ATS-21D-192-C2-R0
AI

The **ATS-21D-192-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** manufactured by Advanced Thermal Solutions, Inc. (ATS). It is designed to dissipate heat from integrated circuits (ICs), CPUs, or other surface-mount electronic components.
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### Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) |
| **Series** | pushPIN™ |
| **Thermal Resistance (Flow)** | 2.35°C/W @ 100 LFM |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Brass) |
| **Spring Type** | Compression Spring (Stainless Steel) |
| **Dimensions (L x W x H)** | 45mm x 45mm x 30mm |
| **Thermal Interface Material** | T766 (Pre-applied) |
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### Key Design Components
#### 1. Heat Sink Body (Aluminum)
The body is constructed from high-grade aluminum. It uses a **cross-cut fin design**, which increases surface area and allows for multi-directional airflow. This makes it efficient in systems where the direction of the cooling fan might vary.
#### 2. pushPIN™ Attachment System
Instead of using messy adhesives or fragile clips, this part uses a mechanical **push-pin** system.
* **Brass Pins:** Provide a secure mechanical connection to the PCB.
* **Compression Springs:** Ensure consistent pressure between the heatsink and the component, optimizing thermal transfer.
#### 3. Thermal Interface Material (TIM)
The part comes with **T766** pre-applied to the base. This material fills microscopic air gaps between the component and the heatsink, significantly lowering thermal resistance.
#### 4. Blue Anodized Finish
The blue coating is not just for aesthetics; anodizing increases surface emissivity and provides corrosion resistance, protecting the aluminum from environmental degradation.
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### Physical Dimensions (Internal View)
```markdown
Dimension A: 45.00 mm (Length)
Dimension B: 45.00 mm (Width)
Dimension C: 30.00 mm (Height/Depth)
Dimension E: 38.00 mm (Hole Spacing - X)
Dimension F: 38.00 mm (Hole Spacing - Y)
```
### Typical Applications
* **Networking Equipment:** Routers and switches.
* **Power Supplies:** Heat dissipation for MOSFETs or Voltage Regulators.
* **Embedded Systems:** Industrial PCs and controllers requiring high-reliability cooling.
- ⤷
What are the PCB hole size requirements for the push-pin mounting?
- ⤷ How does the T766 thermal material compare to standard thermal paste?
- ⤷ Is there a low-profile version of this heatsink available?