The **ATS-21D-210-C2-R0** is a high-performance electronic thermal management component, specifically a **heat sink** designed for cooling integrated circuits (ICs) and other electronic components. It belongs to the *maxiFLOW™* series produced by **Advanced Thermal Solutions (ATS)**. --- ### 1. Technical Specifications Below are the primary electronic and physical specifications for this part: | Parameter | Specification | | :--- | :--- | | **Part Number** | ATS-21D-210-C2-R0 | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 70.00mm x 70.00mm x 6.00mm | | **Thermal Resistance (Unducted)** | 5.18°C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 0.98°C/W @ 200 LFM | | **Thermal Interface Material** | T766 (High performance) | --- ### 2. Design Characteristics #### A. Fin Profile (maxiFLOW™) The "210" designation refers to a specific fin pattern designed to maximize surface area and airflow efficiency. The low-profile height (6mm) makes it ideal for dense electronic assemblies where vertical clearance is limited (e.g., 1U servers or thin networking equipment). #### B. pushPIN™ Attachment System This part uses a specific mounting mechanism that consists of: * **Plastic/Brass Pins:** To secure the heat sink to the PCB. * **Compression Springs:** To provide precise, uniform pressure on the electronic component (CPU/GPU/FPGA), ensuring optimal heat transfer through the thermal interface material. #### C. Thermal Interface Material (TIM) The unit comes pre-applied with **T766**, a phase-change material or high-conductivity thermal pad. This eliminates the need for manual thermal paste application and ensures low contact resistance between the chip and the aluminum base. --- ### 3. Applications in Electronics The ATS-21D-210-C2-R0 is typically used in the following electronic sectors: 1. **Telecommunications:** Cooling of high-speed ASICs in routers and switches. 2. **Embedded Computing:** Thermal management for SoCs (System on Chips) in industrial controllers. 3. **Power Electronics:** Dissipating heat from MOSFET arrays or power conversion modules. 4. **Edge AI:** Cooling low-profile AI accelerators and FPGA modules. --- ### 4. Part Number Breakdown (Nomenclature) * **ATS**: Manufacturer (Advanced Thermal Solutions). * **21**: Series designation. * **D**: Internal design iteration. * **210**: Specific fin geometry/density. * **C2**: Material/Finish code (Blue Anodized Aluminum). * **R0**: Revision/Packaging code.