The **ATS-21D-24-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "superGRIP" series, designed specifically for cooling electronic components such as BGAs (Ball Grid Arrays) and other surface-mount packages. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Al) | | **Finish** | Blue Anodized | | **Dimensions** | 58.42mm x 58.42mm | | **Height** | 20.00mm | | **Fin Style** | High-performance Fine Pitch (Straight Fin) | | **Attachment Method** | superGRIP (Clip-on) | | **Thermal Resistance** | ~1.6°C/W (at 200 LFM) | --- ### 2. Key Electronic Features #### A. Thermal Management The primary purpose of this part is to dissipate heat from integrated circuits (ICs). By increasing the surface area through its fine-pitch fin design, it prevents thermal throttling and component failure in high-performance processors. #### B. superGRIP™ Attachment Technology This is a "clip" based system rather than an adhesive or screw-based system. * **No Holes Required:** It does not require holes in the PCB, which saves board real estate. * **Constant Pressure:** The clip provides consistent pressure across the interface, ensuring the thermal interface material (TIM) performs optimally. * **Stress Reduction:** It avoids placing mechanical stress on the solder balls of BGA packages. #### C. Component Compatibility The **C2** designation in the part number typically indicates the specific thermal interface material or clip strength used. This model is generally compatible with standard high-power electronic components like: * FPGAs (Field Programmable Gate Arrays) * Network Processors * ASICs (Application-Specific Integrated Circuits) --- ### 3. Part Number Breakdown The part number follows a specific nomenclature used by Advanced Thermal Solutions: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **21D** | Base Model/Series (High-performance straight fin) | | **24** | Dimension/Variation Code | | **C2** | Thermal Interface Material / Color / Clip Version | | **R0** | RoHS Compliant / Revision code | --- ### 4. Implementation Considerations When using this heat sink in an electronic design, consider the following: * **Airflow Direction:** Straight fin heat sinks are directional; for maximum efficiency, airflow must move parallel to the fins. * **Clearance:** Ensure there is a 20mm vertical clearance above the chip to accommodate the height. * **TIM:** This model usually comes with pre-applied high-performance thermal tape or interface pads to ensure low thermal resistance between the chip and the aluminum.