The **ATS-21D-35-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "maxiFLOW™" series, designed to dissipate heat from integrated circuits (ICs) and other electronic components. --- ## 1. Technical Specifications The following table outlines the physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Black Anodized) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 35mm x 35mm x 10mm | | **Thermal Resistance** | 12.48 °C/W (at 200 LFM) | | **Thermal Interface Material** | T766 (High performance) | | **Fin Type** | Fine Pitch (maxiFLOW) | --- ## 2. Key Electronic Features ### A. maxiFLOW™ Fin Design The electronic performance of this part is defined by its **maxiFLOW™** geometry. Unlike standard square fins, these have a spread-out profile that reduces pressure drop and increases the surface area for convection, which is critical for densely packed PCBs. ### B. Thermal Interface Material (TIM) The unit comes pre-applied with **T766 thermal grease**. In electronics, the TIM is vital because it fills microscopic air gaps between the semiconductor (e.g., a CPU or FPGA) and the heat sink, ensuring maximum heat transfer efficiency. ### C. pushPIN™ Attachment System To protect delicate electronic components, this part uses a **pushPIN™** system. This ensures: * **Constant Pressure:** Prevents mechanical stress on the solder joints of the BGA/LGA package. * **Tool-less Assembly:** Simplifies the manufacturing process of the circuit board. --- ## 3. Applications in Electronics This specific heat sink is typically used for the following types of electronic devices: * **Field Programmable Gate Arrays (FPGAs)** * **Application-Specific Integrated Circuits (ASICs)** * **Network Switches and Routers** * **Embedded Computing Modules** ---