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  • ATS-21D-50-C2-R0

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    The **ATS-21D-50-C2-R0** is a high-performance electronic thermal management component, specifically a **push-pin heat sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Key Technical Specifications The part number itself contains encoded information about its dimensions and material properties. | Feature | Specification | | :--- | :--- | | **Product Type** | Heat Sink (Push-Pin) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Fin Style** | Fine Pitch (Straight Fin) | | **Attachment Method** | Push-Pin with Brass Springs | | **Thermal Resistance** | ~19.00 °C/W (Unducted Flow @ 200 LFM) | --- ### 2. Physical Dimensions Precision sizing is critical for ensuring the heat sink fits within the PCB layout without interfering with surrounding capacitors or connectors. * **Length (Width):** 40.00 mm * **Width (Depth):** 40.00 mm * **Height:** 15.00 mm * **Pin Pitch:** 33.00 mm (Distance between mounting holes) --- ### 3. Electronic Design Considerations When integrating the ATS-21D-50-C2-R0 into an electronic assembly, several engineering factors must be considered: #### A. Thermal Interface Material (TIM) The "R0" suffix indicates that this model typically comes with **T766 Phase Change Material** pre-applied to the base. This material fills microscopic air gaps between the semiconductor die and the heat sink to maximize heat transfer. #### B. Mounting System * **Push-Pins:** Plastic or metal pins that snap into pre-drilled holes in the PCB. * **Compression Springs:** The brass springs provide consistent pressure (Force), ensuring a reliable thermal bond even under mechanical vibration or thermal expansion. #### C. Airflow Orientation The straight-fin design is optimized for **longitudinal airflow**. For maximum efficiency, the system fan should blow air parallel to the fins. --- ### 4. Part Number Breakdown (Nomenclature) ```text ATS - 21 D - 50 - C2 - R0 | | | | | | | | | | | └── Thermal Interface Material (T766) | | | | └─────── Color/Finish (Blue Anodized) | | | └──────────── Height Code (15mm) | | └──────────────── Attachment Style (Push-Pin) | └─────────────────── Fin Geometry (Fine Pitch) └──────────────────────── Manufacturer (Advanced Thermal Solutions) ```
    ✨ Follow-up Questions
    • ⤷ What are the recommended PCB hole sizes for this push-pin assembly?
    • ⤷ How does the thermal resistance change at higher airflow (LFM) levels?
    • ⤷ Is this heat sink compatible with lead-free soldering processes?