ATS-21D-50-C2-R0
AI

The **ATS-21D-50-C2-R0** is a high-performance electronic thermal management component, specifically a **push-pin heat sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs.
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### 1. Key Technical Specifications
The part number itself contains encoded information about its dimensions and material properties.
| Feature | Specification |
| :--- | :--- |
| **Product Type** | Heat Sink (Push-Pin) |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Fin Style** | Fine Pitch (Straight Fin) |
| **Attachment Method** | Push-Pin with Brass Springs |
| **Thermal Resistance** | ~19.00 °C/W (Unducted Flow @ 200 LFM) |
---
### 2. Physical Dimensions
Precision sizing is critical for ensuring the heat sink fits within the PCB layout without interfering with surrounding capacitors or connectors.
* **Length (Width):** 40.00 mm
* **Width (Depth):** 40.00 mm
* **Height:** 15.00 mm
* **Pin Pitch:** 33.00 mm (Distance between mounting holes)
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### 3. Electronic Design Considerations
When integrating the ATS-21D-50-C2-R0 into an electronic assembly, several engineering factors must be considered:
#### A. Thermal Interface Material (TIM)
The "R0" suffix indicates that this model typically comes with **T766 Phase Change Material** pre-applied to the base. This material fills microscopic air gaps between the semiconductor die and the heat sink to maximize heat transfer.
#### B. Mounting System
* **Push-Pins:** Plastic or metal pins that snap into pre-drilled holes in the PCB.
* **Compression Springs:** The brass springs provide consistent pressure (Force), ensuring a reliable thermal bond even under mechanical vibration or thermal expansion.
#### C. Airflow Orientation
The straight-fin design is optimized for **longitudinal airflow**. For maximum efficiency, the system fan should blow air parallel to the fins.
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### 4. Part Number Breakdown (Nomenclature)
```text
ATS - 21 D - 50 - C2 - R0
| | | | | |
| | | | | └── Thermal Interface Material (T766)
| | | | └─────── Color/Finish (Blue Anodized)
| | | └──────────── Height Code (15mm)
| | └──────────────── Attachment Style (Push-Pin)
| └─────────────────── Fin Geometry (Fine Pitch)
└──────────────────────── Manufacturer (Advanced Thermal Solutions)
```
- ⤷
What are the recommended PCB hole sizes for this push-pin assembly?
- ⤷ How does the thermal resistance change at higher airflow (LFM) levels?
- ⤷ Is this heat sink compatible with lead-free soldering processes?