The **ATS-21D-57-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from integrated circuits (ICs) and other surface-mount components. --- ### 1. Technical Specifications The part belongs to the **pushPIN™** series, which focuses on high-efficiency cooling and secure mechanical mounting. | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (Blue Anodized) | | **Thermal Resistance (Flow)** | 13.16°C/W @ 100 LFM | | **Thermal Resistance (Static)** | 2.14°C/W @ 600 LFM | | **Attachment Type** | Push-Pin (Plastic/Brass) | | **Dimensions (L x W x H)** | 40mm x 40mm x 20mm | | **Fin Configuration** | Fine Pitch (Cross-Cut) | --- ### 2. Physical Design Features The electronic design of this part centers on three main physical attributes: * **Cross-Cut Fin Pattern:** The "fine-pitch" fin design increases the surface area for heat exchange. This is critical for electronic components that generate high heat in a small footprint. * **Aluminum Body:** Chosen for its high thermal conductivity and lightweight properties, ensuring it does not add excessive mechanical stress to the PCB. * **Interface Material:** Usually paired with a high-performance **Thermal Interface Material (TIM)** or "Pre-applied Thermal Pad" to bridge the microscopic air gaps between the heat source (CPU/GPU/ASIC) and the heat sink base. --- ### 3. Mounting Mechanism (Push-Pin) Unlike adhesive-based heat sinks, the ATS-21D-57-C2-R0 uses a mechanical attachment system: 1. **Spring-Loaded Pins:** Provides consistent pressure (force) across the component, which is vital for maintaining thermal contact under vibration or thermal expansion. 2. **Hole Pattern:** Requires specific drill holes on the PCB (usually 3.175mm diameter) to lock the pins in place. 3. **Reliability:** Mechanical mounting is preferred in high-reliability industrial or telecommunications hardware compared to thermal tape, which can degrade over time. --- ### 4. Typical Applications This part is commonly found in the following electronic systems: * **Networking Hardware:** Routers and switches with high-speed processors. * **Embedded Systems:** Industrial PCs where fanless or passive cooling is required. * **Power Electronics:** Transistors or voltage regulators that operate at high temperatures.