## Technical Overview: ATS-21D-71-C2-R0 The **ATS-21D-71-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **maxiFLOW™** series, specifically designed for cooling high-power electronic components such as CPUs, GPUs, FPGAs, and ASICs where space is restricted but airflow is available. --- ### 1. Key Technical Specifications The following table summarizes the primary physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Material** | Aluminum (Black Anodized) | | **Attachment Method** | pushPIN™ (Brass/Plastic pins with springs) | | **Dimensions (L x W x H)** | 45.0mm x 45.0mm x 30.0mm | | **Thermal Resistance** | 1.15 °C/W (at 200 LFM) | | **Flow Pattern** | Straight Fin | | **RoHS Status** | Compliant | --- ### 2. Design and Component Breakdown This assembly consists of several distinct electronic cooling components working together: #### A. Heat Sink Body (maxiFLOW™) * **Fin Geometry:** It features a "tapered" fin design. The fins are wider at the base and thinner at the tips, which maximizes surface area while minimizing the pressure drop as air moves through the sink. * **Material:** Made from high-grade aluminum. The **Black Anodized** finish isn't just for aesthetics; it increases surface emissivity, slightly improving heat dissipation via radiation. #### B. The pushPIN™ Attachment System Instead of using messy adhesives or simple clips, the **-R0** version utilizes a specialized mechanical attachment: * **Plastic/Brass Pins:** Inserted through the PCB (Printed Circuit Board) into pre-drilled holes. * **Stainless Steel Springs:** Provide precise, consistent pressure (preload) against the component. This ensures optimal contact with the thermal interface material. #### C. Thermal Interface Material (TIM) * **Pre-Applied Film:** These units typically come with a high-performance phase-change material or thermal pad pre-applied to the base. This eliminates air gaps between the chip and the heat sink. --- ### 3. Performance Metrics Thermal resistance (measured in °C/W) determines how effectively the part moves heat away from the silicon die. | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 1.15 | | 300 (1.5 m/s) | 0.82 | | 400 (2.0 m/s) | 0.68 | | 500 (2.5 m/s) | 0.60 | --- ### 4. Typical Applications * **Telecommunications:** Cooling high-speed switching equipment. * **Embedded Systems:** For industrial PCs where heat dissipation is critical for longevity. * **Power Supplies:** Cooling MOSFETs and voltage regulators.