The **ATS-21D-79-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "maxiFLOW™" series, designed for cooling high-power electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications Below is a breakdown of the physical and thermal properties of this specific part number: | Specification | Details | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Series** | maxiFLOW™ | | **Material** | Aluminum (with Blue Anodized finish) | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 30.00mm | | **Thermal Resistance** | 2.63°C/W @ 200 LFM (Linear Feet per Minute) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Design Characteristics The part is engineered for maximum heat dissipation in constrained spaces. * **Fin Geometry:** It features a unique "flared fin" design. This increases the surface area for radiation and convection while reducing pressure drop, allowing air to flow through more efficiently compared to standard straight-fin heat sinks. * **Attachment (Push-Pin):** The `-R0` suffix indicates a specific hardware configuration. It uses plastic push-pins and a brass/steel spring to provide a constant, reliable pressure between the heat sink and the electronic chip. * **Material Science:** The aluminum body provides high thermal conductivity, and the blue anodized surface treatment improves emissivity and protects the metal from oxidation. --- ### 3. Part Number Breakdown The nomenclature for this part follows the standard ATS coding system: 1. **ATS:** Manufacturer prefix. 2. **21:** Series (maxiFLOW). 3. **D:** Indicates the height/profile of the component. 4. **79:** Specific footprint/model identifier. 5. **C2:** Material/Finish code (Blue Anodized). 6. **R0:** Revision or Hardware configuration (Push-pin/Spring type). --- ### 4. Typical Applications * **Network Switches:** Cooling high-speed processing chips. * **Power Supplies:** Managing heat in high-efficiency DC-DC converters. * **Embedded Systems:** Industrial PCs or automation controllers where airflow is directional.