The **ATS-21D-83-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions Inc. It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors. ### 1. Technical Specifications The part number follows a specific nomenclature used by Advanced Thermal Solutions (ATS). Here are the primary specifications: | Feature | Specification | | :--- | :--- | | **Product Type** | Heat Sink | | **Series** | pushPIN™ | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Fin Type** | Straight Fin | | **Thermal Resistance** | 1.62°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 30mm x 30mm x 20mm | --- ### 2. Key Component Breakdown #### A. The Heat Sink Body The body is made of **Aluminum**, which offers a high thermal conductivity-to-weight ratio. The **Straight Fin** design allows for efficient airflow, making it ideal for systems with forced-air cooling (fans). #### B. Push-Pin Mounting System The "21D" and "C2" parts of the code refer to the mounting mechanism. It uses a **Push-Pin** style with a compression spring. This ensures: * **Constant Pressure:** Prevents the heat sink from shifting. * **Ease of Assembly:** No special tools are required for installation on a PCB with pre-drilled holes. #### C. Thermal Interface Material (TIM) The "-R0" suffix indicates that the unit comes with **pre-applied Thermal Interface Material**. This is typically a high-performance phase-change material or thermal pad that fills microscopic air gaps between the chip and the heat sink. --- ### 3. Application Use Cases This specific model is commonly used in: * **Embedded Systems:** Industrial PCs and controllers. * **Telecommunications:** Network switches and routers. * **Power Supplies:** Cooling voltage regulators and MOSFETs. --- ### 4. Thermal Performance Data Performance varies based on the airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 1.62 | | 300 (1.5 m/s) | 0.82 | | 500 (2.5 m/s) | 0.61 |