The **ATS-21D-90-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** product line, known for its high-density fin patterns and low pressure drop. --- ### 1. Technical Specifications Below are the primary mechanical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Extruded) | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 25.00mm | | **Attachment Method** | pushPIN™ (Brass/Plastic pins) | | **Thermal Resistance** | 6.36°C/W (at 200 LFM) | | **Spring Type** | XCUT (Stainless Steel) | | **Thermal Interface Material** | T766 (Pre-applied Phase Change) | --- ### 2. Key Electronic & Physical Components #### A. The Fins (Heat Dissipation) The "90" in the part number refers to the specific fin density and arrangement. The fins are designed to increase the surface area available for convective heat transfer. In this model, they use a **straight fin** design optimized for airflow through the chassis. #### B. The Attachment System (pushPIN™) This part uses the proprietary ATS pushPIN™ system. This is critical for electronic stability because: - **Uniform Pressure:** It ensures the heat sink is pressed against the CPU/GPU with specific force. - **Vibration Resistance:** The stainless steel springs prevent the heat sink from shifting during transport or operation. #### C. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied. This is a "Phase Change" material that softens at high temperatures, filling microscopic air gaps between the electronic component (die) and the aluminum base of the heat sink to ensure maximum thermal conductivity. --- ### 3. Application Use Cases This specific part is generally used for the following electronic systems: 1. **Network Switches/Routers:** Cooling ASICs and high-speed processors. 2. **Industrial PCs:** Managing heat in fanless or low-airflow environments. 3. **Power Modules:** Dissipating heat from MOSFETs or IGBTs in power conversion. ---