The **ATS-21D-91-C2-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the high-performance heatsink series, specifically designed for cooling electronic components like CPUs, GPUs, or BGAs. --- ### ## Technical Specifications Below are the primary electronic and physical specifications for this part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-21D-91-C2-R0 | | **Component Type** | Heat Sink | | **Attachment Method** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 21.97°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 10.00mm | --- ### ## Key Electronic & Thermal Components ### 1. Thermal Management Properties The "electronic" function of this part is passive thermal management. It dissipates heat generated by semiconductor junctions to prevent thermal throttling or hardware failure. * **Thermal Resistance:** It is rated for a resistance of **21.97°C/W** at low airflow, dropping significantly as air velocity increases. * **Heat Transfer:** Designed for high-density electronic packaging where vertical space is limited (10mm height). ### 2. The pushPIN™ Attachment System Unlike adhesive-based heatsinks, the `-R0` suffix indicates a mechanical attachment system. * **Springs:** Uses a stainless steel or brass spring to provide precise pressure (preload) for consistent thermal interface material (TIM) performance. * **Push Pins:** Made of durable plastic or metal, these snap into pre-drilled holes on the PCB, ensuring the heatsink does not shift during vibration or shipping. ### 3. Material Science (Aluminum & Finish) * **AL6063:** The aluminum alloy used provides high thermal conductivity. * **Blue Anodized Coating:** This is not just aesthetic; the anodization layer provides electrical insulation (to prevent shorting if a lead touches the sink) and increases surface emissivity, improving radiation cooling. --- ### ## Usage Context This part is typically found in the following electronic environments: 1. **Telecommunications:** Cooling of networking chips. 2. **Embedded Systems:** Industrial PCs where high reliability is required. 3. **Power Electronics:** Dissipating heat from MOSFET arrays or voltage regulators.