The **ATS-21D-92-C2-R0** is a high-performance electronic component belonging to the thermal management category. Specifically, it is a **Heatsink** designed by Advanced Thermal Solutions (ATS) for cooling integrated circuits (ICs) and other electronic surface-mount devices. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Product Type** | Heatsink (Push-Pin style) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 15.00mm | | **Thermal Resistance** | 16.48°C/W (at 100 LFM) | | **Attachment Method** | Push-Pin (Brass) | | **Thermal Interface Material (TIM)** | T766 (High performance) | --- ### 2. Key Components & Construction #### A. Fin Design (Straight Fin) The "92" series features a **straight fin** design. These fins provide a large surface area for heat dissipation. They are ideal for applications where there is a consistent, unidirectional airflow (forced convection) across the component. #### B. Attachment Mechanism: Push-Pin Unlike adhesive-based heatsinks, the `ATS-21D` uses a **push-pin and spring** system. * **Benefits:** It provides uniform pressure across the component for better heat transfer and is more reliable than "peel-and-stick" tape in high-vibration environments. * **Hardware:** It typically uses brass pins with stainless steel springs to ensure long-term mechanical tension. #### C. Thermal Interface Material (TIM) The part comes pre-applied with **T766**. This is a thermal pad or paste that fills microscopic air gaps between the chip and the heatsink, significantly reducing thermal resistance. --- ### 3. Application Use Cases This specific size (40x40mm) is commonly used for: * **CPUs/GPUs:** Small embedded processors. * **FPGAs:** Field Programmable Gate Arrays that generate significant heat. * **Telecommunications:** Network switches and routers. * **Power Supplies:** Cooling voltage regulators and power MOSFETs. --- ### 4. Thermal Performance Data Performance varies based on the airflow (Measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 | 16.48 | | 200 | 6.17 | | 300 | 4.46 | | 400 | 3.60 | ---