The **ATS-21D-95-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic packages. It is manufactured by Advanced Thermal Solutions (ATS). --- ### Technical Specifications | Parameter | Specification | |:---|:---| | **Part Number** | ATS-21D-95-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 40mm x 40mm x 25mm | | **Thermal Resistance** | 7.29 °C/W (at 100 LFM) | | **Fin Style** | Straight Fin | --- ### Key Electronic Components & Features #### 1. Heat Dissipation Structure The part utilizes a **straight-fin design**. In electronic cooling, fins increase the surface area available for heat transfer between the electronic component (heat source) and the surrounding air. The 25mm height is optimized for high-profile cooling requirements where vertical space is available. #### 2. pushPIN™ Attachment Mechanism Unlike adhesive tapes or simple clips, the `pushPIN™` system ensures: * **Constant Pressure:** A brass or plastic pin with a high-performance compression spring provides consistent pressure across the interface. * **Reliability:** It prevents the heatsink from shifting during mechanical shock or vibration, which is critical for industrial or automotive electronics. #### 3. Thermal Interface Material (TIM) The "C2" in the part number typically refers to the pre-applied thermal interface. This is a phase-change material or thermal grease that fills the microscopic air gaps between the CPU/GPU/MOSFET and the heatsink base, significantly lowering thermal impedance. #### 4. Blue Anodized Finish The blue anodization is not purely aesthetic. It provides: * **Corrosion Resistance:** Protects the aluminum from oxidation. * **Electrical Insulation:** Anodized layers are non-conductive, reducing the risk of short circuits if the heatsink accidentally touches nearby components. --- ### Usage in Circuits This heatsink is typically found on: * **BGA (Ball Grid Array) Chips:** Such as FPGAs, Processors, or Network Switches. * **Power Electronics:** Large MOSFETs or IGBT modules. * **Industrial PCBs:** Where active fan cooling might be limited, and passive or forced-convection cooling is required.