The **ATS-21D-96-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Heat Sink**. It belongs to the *maxiFLOW™* series, designed for cooling high-power semiconductors and electronic modules. --- ### ## Technical Specifications Below are the core technical parameters for this specific part number: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Part Series** | maxiFLOW™ | | **Material** | Aluminum (with Blue Anodized finish) | | **Attachment Method** | pushPIN™ | | **Thermal Resistance (Flow)** | 5.63° C/W @ 100 LFM (linear feet per minute) | | **Thermal Resistance (Static)** | 1.22° C/W @ 800 LFM | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 35.00mm | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### ### Key Components & Design Features #### 1. Pin-Fin Geometry (maxiFLOW™) The "96" in the part number identifies the specific fin configuration. The maxiFLOW design features a flared fin structure that maximizes surface area and increases air turbulence, which significantly improves heat dissipation compared to standard straight-fin heat sinks. #### 2. pushPIN™ Attachment The "21D" prefix indicates the mounting system. This part uses a **pushPIN™** mechanism, which includes: * **Brass/Plastic Pins:** Used to secure the heat sink to the PCB through pre-drilled holes. * **Compression Springs:** These ensure a consistent, high-pressure contact between the heat sink and the electronic component (CPU, FPGA, or GPU), optimizing thermal transfer. #### 3. Thermal Interface Material (TIM) The **C2** designation refers to the pre-applied thermal material. The **T766** compound is a high-performance grease that fills microscopic air gaps between the component die and the heat sink base, ensuring low thermal resistance. #### 4. Material and Finish The **R0** suffix denotes the revision and environmental compliance (RoHS). The body is made of extruded aluminum for lightweight thermal conductivity, and the **Blue Anodized** finish provides surface protection and increased emissivity. --- ### ### Typical Applications * **High-Speed Networking:** Cooling ASICs in switches and routers. * **Power Supplies:** Managing heat in high-density power modules. * **Embedded Computing:** Thermal management for industrial motherboards and processors. ---