The **ATS-21D-98-C2-R0** is a specific part number for a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "maxiFLOW™" series, designed primarily for cooling electronic components like BGA (Ball Grid Array) packages. ### Technical Specifications Below are the primary physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Series** | maxiFLOW™ | | **Material** | Aluminum (Black Anodized) | | **Attachment Method** | maxiGRIP™ (Plastic frame clip and spring) | | **Dimensions** | 45.00mm x 45.00mm | | **Height** | 15.00mm | | **Thermal Resistance** | 1.53°C/W @ 200 LFM | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### Key Electronic & Mechanical Components #### 1. Heat Sink Body (The Fin Structure) * **Design:** The "maxiFLOW" design features a flared fin structure. This increases the surface area for heat dissipation while maintaining a low pressure drop. * **Material:** It is made of extruded aluminum, which provides a high thermal conductivity-to-weight ratio. The **Black Anodized** finish is not just for aesthetics; it increases thermal emissivity, improving heat radiation. #### 2. maxiGRIP™ Attachment System This is a critical mechanical part of the assembly that interacts with the PCB: * **Plastic Frame Clip:** A high-temperature plastic frame that snaps around the electronic component (usually a processor or FPGA). * **Stainless Steel Spring Clip:** A "steady-spring" that applies constant, even pressure across the component. This ensures that the thermal interface material (TIM) makes perfect contact without damaging the solder balls on the BGA. #### 3. Thermal Interface Material (TIM) * **Type:** T766. * **Function:** This is a pre-applied phase-change material or thermal pad on the base of the heat sink. It fills the microscopic air gaps between the component die and the heat sink base to facilitate efficient heat transfer. --- ### Application Use Cases This part is typically used in environments where high-power electronic components are subjected to significant thermal loads: * **Telecommunications:** Network switches and routers. * **Data Centers:** High-speed server processors. * **Embedded Systems:** Industrial computers and FPGA modules. ---