The **ATS-21F-33-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for cooling processors and other high-heat surface-mount components. --- ### 1. Technical Specifications The part number encodes specific physical and thermal characteristics: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Attachment Type** | Push-Pin (Plastic) | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W x H)** | 54mm x 54mm x 15mm | | **Thermal Resistance** | ~3.79°C/W (at 200 LFM) | | **Fin Style** | Straight Fin | --- ### 2. Electronic & Mechanical Parts Breakdown The assembly consists of three primary components that work together to provide thermal stability to an electronic circuit: #### A. The Heat Sink Body (Aluminum) * **Material:** 6063 Aluminum alloy, which offers excellent thermal conductivity. * **Surface Finish:** Blue Anodized. This thin oxide layer prevents corrosion and improves emissivity (radiant heat transfer). * **Design:** The maxiFLOW™ pattern uses a high-aspect-ratio fin design to maximize surface area contact with the air. #### B. The Push-Pin Fasteners * **Material:** Nylon (Plastic). * **Function:** These provide the mechanical force needed to hold the heat sink against the chip. * **Springs:** Usually paired with a compression spring to ensure constant downward pressure, compensating for thermal expansion and vibration. #### C. Thermal Interface Material (TIM) * **Type:** Pre-applied T766 phase-change material or similar. * **Purpose:** Fills the microscopic air gaps between the heat source (IC/CPU) and the aluminum base to reduce thermal impedance. --- ### 3. Application Use Cases This specific part is typically found in the following electronic environments: 1. **Networking Hardware:** Switches, routers, and high-speed gateways. 2. **Embedded Systems:** Industrial PCs and motherboards using BGAs (Ball Grid Arrays). 3. **Power Supplies:** Cooling high-wattage voltage regulators or MOSFETs. --- ### 4. Mounting Requirements To use this part, the Printed Circuit Board (PCB) must have: * Two pre-drilled holes spaced according to the ATS-21F specification. * Clearance around the component to accommodate the 54mm x 54mm footprint.