ATS-21F-35-C2-R0
AI

The **ATS-21F-35-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed for high-velocity airflow environments.
### 1. Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) |
| **Part Number** | ATS-21F-35-C2-R0 |
| **Type** | Board Level Heat Sink |
| **Material** | Aluminum (Black Anodized) |
| **Attachment Method** | pushPIN™ |
| **Thermal Resistance** | 12.42°C/W (Unducted @ 100 LFM) |
| **Thermal Interface Material** | T766 (Pre-applied) |
---
### 2. Design and Construction
#### **The maxiFLOW™ Geometry**
The "F" in the part number signifies the **flared fin** design. Unlike standard straight-fin heat sinks, flared fins increase the surface area and provide better pressure drop characteristics, making them highly efficient in forced-air cooling systems.
#### **Material and Finish**
* **Aluminum:** Chosen for its excellent thermal conductivity and lightweight properties.
* **Black Anodized:** The surface treatment increases emissivity, which improves heat dissipation via radiation.
#### **Attachment System: pushPIN™**
The part uses a specialized **pushPIN™** mechanism. This replaces traditional adhesive tapes or clips with a secure, vibration-resistant mount that consists of:
* A flexible spring.
* A plastic or brass pin that snaps into pre-drilled holes on the PCB.
* This ensures consistent pressure on the component (e.g., a BGA chip) for optimal heat transfer.
---
### 3. Dimensional Data
| Dimension | Value |
| :--- | :--- |
| **Length/Width** | 35mm x 35mm |
| **Height** | 9.90mm |
| **Mounting Hole Spacing** | ~40mm (Diagonal) |
---
### 4. Thermal Performance
The efficiency of this heat sink depends heavily on the **Airflow Velocity (LFM - Linear Feet per Minute)**:
* **@ 100 LFM:** 12.42 °C/W
* **@ 300 LFM:** 6.13 °C/W
* **@ 500 LFM:** 4.41 °C/W
*Note: Lower °C/W values indicate better cooling performance.*
- ⤷
What are the benefits of using a flared fin design over a straight fin design?
- ⤷ How do I calculate if this heat sink is sufficient for my component's TDP?
- ⤷ Can the pushPIN attachment be used on any standard PCB?