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  • ATS-21F-35-C2-R0

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    The **ATS-21F-35-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed for high-velocity airflow environments. ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-21F-35-C2-R0 | | **Type** | Board Level Heat Sink | | **Material** | Aluminum (Black Anodized) | | **Attachment Method** | pushPIN™ | | **Thermal Resistance** | 12.42°C/W (Unducted @ 100 LFM) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Design and Construction #### **The maxiFLOW™ Geometry** The "F" in the part number signifies the **flared fin** design. Unlike standard straight-fin heat sinks, flared fins increase the surface area and provide better pressure drop characteristics, making them highly efficient in forced-air cooling systems. #### **Material and Finish** * **Aluminum:** Chosen for its excellent thermal conductivity and lightweight properties. * **Black Anodized:** The surface treatment increases emissivity, which improves heat dissipation via radiation. #### **Attachment System: pushPIN™** The part uses a specialized **pushPIN™** mechanism. This replaces traditional adhesive tapes or clips with a secure, vibration-resistant mount that consists of: * A flexible spring. * A plastic or brass pin that snaps into pre-drilled holes on the PCB. * This ensures consistent pressure on the component (e.g., a BGA chip) for optimal heat transfer. --- ### 3. Dimensional Data | Dimension | Value | | :--- | :--- | | **Length/Width** | 35mm x 35mm | | **Height** | 9.90mm | | **Mounting Hole Spacing** | ~40mm (Diagonal) | --- ### 4. Thermal Performance The efficiency of this heat sink depends heavily on the **Airflow Velocity (LFM - Linear Feet per Minute)**: * **@ 100 LFM:** 12.42 °C/W * **@ 300 LFM:** 6.13 °C/W * **@ 500 LFM:** 4.41 °C/W *Note: Lower °C/W values indicate better cooling performance.*
    ✨ Follow-up Questions
    • ⤷ What are the benefits of using a flared fin design over a straight fin design?
    • ⤷ How do I calculate if this heat sink is sufficient for my component's TDP?
    • ⤷ Can the pushPIN attachment be used on any standard PCB?