The **ATS-21F-38-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** series, designed to provide high thermal performance in environments with restricted airflow. --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Material** | Aluminum (Anodized Blue) | | **Attachment Method** | maxiGRIP™ (Frame Clip) | | **Thermal Resistance** | 1.40 °C/W (at 200 LFM) | | **Dimensions (L x W)** | 40mm x 40mm | | **Height** | 22.86mm | | **Interface Material** | T766 (Thermal Tape) | --- ### 2. Physical Design & Features #### A. Fin Geometry (maxiFLOW™) The part features a unique **flared fin design**. Unlike standard straight-fin heat sinks, these fins spread outwards. This increases the surface area and creates more turbulence in the airflow, which significantly enhances the cooling capacity compared to traditional designs. #### B. The maxiGRIP™ Attachment System This part uses a specialized mechanical fastening system rather than just adhesive: * **Plastic Frame Clip:** A high-tension clip that surrounds the component. * **Stainless Steel Spring Clip:** Applies steady downward pressure to ensure maximum contact between the heat sink and the chip. * **Benefit:** It allows for easy removal and re-attachment without damaging the PCB (Printed Circuit Board). #### C. Thermal Interface Material (TIM) The "C2" in the part number indicates it comes pre-applied with **T766 thermal phase-change material**. This eliminates the need for manual application of thermal paste and ensures a consistent thermal bond. --- ### 3. Applications This specific heat sink is typically used for cooling high-heat-generating integrated circuits (ICs), such as: * **CPUs/GPUs** in embedded systems. * **FPGAs** (Field Programmable Gate Arrays). * **Telecommunications** equipment (Routers, Switches). * **Power Supplies** and high-speed memory modules. --- ### 4. Part Number Breakdown | Segment | Meaning | | :--- | :--- | | **ATS-21F** | Series Identifier (maxiFLOW with maxiGRIP) | | **38** | Dimensional code (specific to 40x40 footprint) | | **C2** | Thermal Interface Material (T766) | | **R0** | RoHS Compliant / Revision code |