The **ATS-21F-40-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push-pin" series designed for cooling integrated circuits (ICs) and other electronic packages. --- ### 1. Technical Specifications Below is a breakdown of the physical and thermal characteristics of this specific part: | Parameter | Specification | | :--- | :--- | | **Product Type** | Heat Sink | | **Series** | pushPIN™ | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Fin Type** | Straight Fin | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions (L x W)** | 54.00 mm x 54.00 mm | | **Height (Fin)** | 25.00 mm | | **Thermal Resistance** | ~1.45 °C/W (at 200 LFM) | --- ### 2. Electronic Application & Usage This part is used in environments where electronic components (like CPUs, FPGAs, or GPUs) generate significant heat that must be dissipated to prevent thermal throttling or hardware failure. * **Attachment Mechanism:** The "Push-Pin" design uses a pre-drilled hole on the PCB. A spring-loaded pin is pushed through, providing constant pressure on the chip to ensure maximum thermal contact. * **Interface Material:** These units typically come with a pre-applied **Thermal Interface Material (TIM)**, such as a high-performance thermal pad or grease, to fill microscopic air gaps between the component and the heat sink. * **Airflow Compatibility:** The straight-fin design is optimized for environments with consistent directional airflow, allowing air to pass through the channels and carry heat away. --- ### 3. Part Number Decoding Understanding the nomenclature helps in identifying variants: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer: Advanced Thermal Solutions | | **21F** | Series/Footprint classification | | **40** | Fin pitch/Internal geometry code | | **C2** | Thermal Interface Material (T766 or similar high-performance) | | **R0** | RoHS compliance and revision status | --- ### 4. Implementation Code Example In thermal simulation (using Python for simplified calculations), one might model the temperature rise of a component using this heat sink's thermal resistance: ```python def calculate_temp_rise(power_watts, thermal_resistance): """ Calculates the temperature increase of the component above ambient temperature. """ rise = power_watts * thermal_resistance return rise # Example for ATS-21F-40-C2-R0 power = 25.0 # Power dissipated by the chip in Watts r_theta = 1.45 # Thermal resistance in °C/W temp_increase = calculate_temp_rise(power, r_theta) print(f"Temperature Increase: {temp_increase}°C above ambient") ```