ATS-21F-47-C2-R0
AI

The **ATS-21F-47-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power semiconductors.
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### 1. Technical Specifications
The part number follows a specific nomenclature that defines its physical and thermal characteristics:
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | pushPIN™ HS |
| **Base Dimensions** | 30.00 mm x 30.00 mm |
| **Height (Fin)** | 25.00 mm |
| **Fin Pitch** | COARSE-PITCH |
| **Fin Pattern** | STRAIGHT |
| **Material** | Aluminum (AL6063) |
| **Attachment Method** | pushPIN™ (Spring-loaded pins) |
| **Thermal Interface (TIM)** | T766 (Pre-applied) |
---
### 2. Key Electronic Features
#### A. Thermal Resistance
This component is engineered to provide low thermal resistance, measured in °C/W. At typical airflow (e.g., 100-200 LFM), it ensures that the junction temperature of the electronic chip remains within safe operational limits.
#### B. pushPIN™ Attachment System
Unlike adhesive-based heat sinks, the `-C2` designation refers to the specific attachment kit. It uses high-performance plastic or brass pins and springs to provide:
* **Constant Pressure:** Ensures a tight, uniform bond between the chip and the heat sink.
* **Mechanical Reliability:** Reduces the risk of the heat sink falling off due to vibration or thermal cycling.
#### C. Thermal Interface Material (TIM)
The part comes with **T766** pre-applied. This is a phase-change material or high-performance grease that fills microscopic air gaps between the component and the heat sink to maximize heat transfer efficiency.
---
### 3. Application Use Cases
The ATS-21F-47-C2-R0 is commonly used in:
* **Embedded Systems:** Industrial PCs where space is limited but cooling is critical.
* **Power Supplies:** Cooling MOSFETs or Voltage Regulators.
* **Networking:** Small-form-factor routers and switches.
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### 4. Dimensional Code Breakdown
```text
ATS - 21 - F - 47 - C2 - R0
| | | | | |
| | | | | +-- Revision/Version
| | | | +------- Mounting/Attachment Type (pushPIN)
| | | +------------ Fin Height/Pattern ID
| | +---------------- Fin Type (F = Fine or specific pitch)
| +--------------------- Dimensions Category
+-------------------------- Advanced Thermal Solutions (Brand)
```
- ⤷
What is the thermal resistance value of this heat sink at 200 LFM?
- ⤷ What are the advantages of using pushPIN vs. thermal tape for this part?
- ⤷ Is there a version of this heat sink with a different height for lower profile cases?