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  • ATS-21F-47-C2-R0

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    The **ATS-21F-47-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power semiconductors. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ HS | | **Base Dimensions** | 30.00 mm x 30.00 mm | | **Height (Fin)** | 25.00 mm | | **Fin Pitch** | COARSE-PITCH | | **Fin Pattern** | STRAIGHT | | **Material** | Aluminum (AL6063) | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Thermal Interface (TIM)** | T766 (Pre-applied) | --- ### 2. Key Electronic Features #### A. Thermal Resistance This component is engineered to provide low thermal resistance, measured in °C/W. At typical airflow (e.g., 100-200 LFM), it ensures that the junction temperature of the electronic chip remains within safe operational limits. #### B. pushPIN™ Attachment System Unlike adhesive-based heat sinks, the `-C2` designation refers to the specific attachment kit. It uses high-performance plastic or brass pins and springs to provide: * **Constant Pressure:** Ensures a tight, uniform bond between the chip and the heat sink. * **Mechanical Reliability:** Reduces the risk of the heat sink falling off due to vibration or thermal cycling. #### C. Thermal Interface Material (TIM) The part comes with **T766** pre-applied. This is a phase-change material or high-performance grease that fills microscopic air gaps between the component and the heat sink to maximize heat transfer efficiency. --- ### 3. Application Use Cases The ATS-21F-47-C2-R0 is commonly used in: * **Embedded Systems:** Industrial PCs where space is limited but cooling is critical. * **Power Supplies:** Cooling MOSFETs or Voltage Regulators. * **Networking:** Small-form-factor routers and switches. --- ### 4. Dimensional Code Breakdown ```text ATS - 21 - F - 47 - C2 - R0 | | | | | | | | | | | +-- Revision/Version | | | | +------- Mounting/Attachment Type (pushPIN) | | | +------------ Fin Height/Pattern ID | | +---------------- Fin Type (F = Fine or specific pitch) | +--------------------- Dimensions Category +-------------------------- Advanced Thermal Solutions (Brand) ```
    ✨ Follow-up Questions
    • ⤷ What is the thermal resistance value of this heat sink at 200 LFM?
    • ⤷ What are the advantages of using pushPIN vs. thermal tape for this part?
    • ⤷ Is there a version of this heat sink with a different height for lower profile cases?