The **ATS-21F-50-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for cooling integrated circuits (ICs) and other PCB-mounted components. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Property | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions (L x W)** | 45mm x 45mm | | **Height** | 15mm | | **Fin Style** | XC-CUT (Cross-Cut) | | **Attachment Method** | Push Pin (Plastic) | | **Interface Material** | T766 (Thermal Tape) | --- ### 2. Key Electronic Features #### A. XC-CUT Fin Geometry Unlike straight-fin heat sinks, the XC-CUT design allows for multi-directional airflow. This is critical in electronics enclosures where the fan placement might not align perfectly with the fins. It increases the surface area and turbulence, enhancing heat dissipation. #### B. Push-Pin Attachment This part utilizes a mechanical push-pin system with a built-in spring. * **Reliability:** Ensures consistent pressure (clamping force) between the heat sink and the electronic component (CPU/GPU/FPGA). * **Ease of Assembly:** Features pre-drilled holes in the PCB for secure mounting without the need for messy liquid adhesives. #### C. Thermal Interface Material (T766) The "C2" suffix typically denotes the inclusion of a pre-applied Thermal Interface Material (TIM). T766 is a phase-change or high-conductivity tape that fills microscopic air gaps between the component and the heat sink to reduce thermal resistance. --- ### 3. Thermal Performance Data Thermal resistance depends on the airflow (measured in Linear Feet per Minute - LFM): | Airflow Rate (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **200 (1.0 m/s)** | ~18.99 | | **400 (2.0 m/s)** | ~12.27 | | **600 (3.0 m/s)** | ~9.25 | --- ### 4. Common Applications * **Embedded Systems:** Cooling high-speed processors. * **Telecommunications:** Cooling ASICs in routers and switches. * **Industrial Power Supplies:** Managing heat in MOSFETs or voltage regulators.