The **ATS-21F-53-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** series, known for its high-density fin structure which optimizes airflow and heat dissipation for integrated circuits. --- ### 1. Technical Specifications The following table summarizes the primary physical and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-21F-53-C2-R0 | | **Product Type** | Heatsink (Air Cooled) | | **Material** | Aluminum (Anodized Blue) | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 40mm x 40mm x 30mm | | **Fin Style** | Straight Fin (maxiFLOW™) | | **Thermal Resistance** | ~1.42 °C/W (at 200 LFM) | | **RoHS Status** | Compliant | --- ### 2. Key Component Features #### A. Attachment System (pushPIN™) This part utilizes the proprietary **pushPIN™** attachment mechanism. Instead of using messy adhesives or simple clips, it uses a spring-loaded pin system. * **Benefits:** Provides precise pressure (Force) to ensure optimal interface between the heatsink and the chip. * **Security:** Prevents the heatsink from shifting during mechanical shock or vibration. #### B. maxiFLOW™ Fin Design The "maxiFLOW" geometry is characterized by a tapered fin structure. * **Airflow Efficiency:** It is designed to maximize the surface area while minimizing pressure drop. * **Versatility:** It performs exceptionally well in "ducted" airflow environments where air is forced directly through the fins. #### C. Phase Change Material (TIM) The "C2" in the part number typically denotes the thermal interface material (TIM) applied to the base. * **Pre-Applied:** It usually comes with a pre-applied thermal pad or phase-change material, reducing assembly time and ensuring a bubble-free contact layer. --- ### 3. Application Use Cases This specific heatsink is generally used for cooling medium-to-high power electronic components, including: * **ASICs and FPGAs:** Used in telecommunications and networking gear. * **Processors:** Embedded CPUs that require active or significant passive cooling. * **Power Supplies:** Cooling high-heat-generating transistors or MOSFETs. ---