The **ATS-21F-63-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the *push-pin* attachment series designed for cooling electronic integrated circuits (ICs). ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Product Series** | push-pin™ HS | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W)** | 40mm x 40mm | | **Height** | 20mm | | **Fin Style** | Straight Fin | | **Attachment Type** | Push-Pin (Brass) | | **Thermal Resistance** | ~2.85°C/W (at 200 LFM) | --- ### 2. Key Electronic Functions While this is a mechanical part, its role in an electronic circuit is critical for maintaining "Thermal Equilibrium." * **Heat Dissipation:** It increases the surface area of a heat-generating component (like a CPU, GPU, or MOSFET). This allows for more efficient heat transfer to the surrounding air. * **Protection (Thermal Throttling):** By keeping the junction temperature ($T_j$) of a semiconductor within safe limits, it prevents the chip from automatically slowing down (throttling) or suffering permanent hardware failure. * **Thermal Interface Material (TIM):** This specific model typically comes pre-applied with **ATS-CPX-143**, a high-performance thermal phase-change material that fills microscopic air gaps between the chip and the heat sink. --- ### 3. Attachment Mechanism The "Push-Pin" system is a specific hardware configuration designed for PCBs (Printed Circuit Boards). * **Brass Push-Pins:** These provide a secure, vibration-resistant mount to the PCB. * **Compression Springs:** These apply a precise amount of downward pressure (Force) to ensure optimal contact with the electronic chip without cracking the silicon die. * **Mounting Holes:** This part requires pre-drilled holes in the PCB, usually spaced at a standard interval (in this case, approximately 33mm). --- ### 4. Part Number Breakdown | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **21F** | Series/Footprint designation | | **63** | Specific height/fin configuration | | **C2** | Thermal Performance/Material grade | | **R0** | Revision/Standard Packaging |