The **ATS-21F-65-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Thermal Resistance** | 7.29 °C/W (at 100 LFM) | | **Weight** | 38 grams | --- ### 2. Physical Dimensions Precision sizing is critical for PCB layout and component clearance. * **Length:** 45.00 mm * **Width:** 45.00 mm * **Height:** 20.00 mm (Profile) * **Pin Pitch:** 38.00 mm (Distance between mounting holes) --- ### 3. Electronic Design Considerations #### A. Thermal Interface Material (TIM) The "C2" in the part number indicates that this unit comes pre-applied with **ATS-PPS-02** thermal interface material. This is a high-performance thermal pad/grease that fills microscopic air gaps between the heat sink and the electronic chip, ensuring efficient heat transfer. #### B. The pushPIN™ Mounting System The mounting hardware consists of a brass or plastic push-pin with a stainless steel spring. This design provides: * **Consistent Pressure:** Ensures the heat sink is pressed firmly against the component with a specific force (load). * **Vibration Resistance:** The spring-loaded mechanism prevents the heat sink from shifting during transport or industrial vibration. #### C. Airflow Optimization The fin pattern is designed for **straight-line airflow**. In an electronic enclosure, the cooling efficiency is highly dependent on the "LFM" (Linear Feet per Minute) of the fans used in the system. --- ### 4. Part Number Breakdown | Segment | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions (Brand) | | **21F** | Heat Sink Series/Family | | **65** | Specific Fin Design/Geometry | | **C2** | Thermal Interface Material (T766/PPS-02) | | **R0** | RoHS Compliant (Lead-free) |