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  • ATS-21F-68-C2-R0

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    The **ATS-21F-68-C2-R0** is a high-performance thermal management component manufactured by **Advanced Thermal Solutions (ATS)**. Specifically, it is a heat sink designed for cooling electronic components such as CPUs, GPUs, and other high-heat-generating surface-mount devices. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to define its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Component Type** | Heat Sink | | **Series** | pushPIN™ | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin | | **Dimensions (L x W)** | 45mm x 45mm | | **Height** | 15mm | | **Fin Style** | Straight Fin | | **Thermal Resistance** | ~15.31 °C/W (Unducted @ 100 LFM) | --- ### 2. Key Design Features #### A. pushPIN™ Attachment System The "21F" designation indicates the use of the **pushPIN™** system. This mechanism provides: * **Constant Pressure:** A high-performance compression spring ensures uniform pressure across the component surface for maximum heat transfer. * **Secure Fit:** Push-pins are available in brass or plastic and are designed to lock into pre-drilled holes on the PCB. #### B. Material and Finish * **Aluminum Construction:** Offers a lightweight solution with excellent thermal conductivity. * **Blue Anodized Coating:** The "C2" suffix refers to the finish. Anodizing increases surface area slightly at a microscopic level, protects against corrosion, and improves emissivity. #### C. Thermal Interface Material (TIM) The "R0" suffix typically denotes that the part comes pre-applied with a high-performance thermal phase-change material or tape, ensuring a "plug-and-play" installation without needing to manually apply thermal paste. --- ### 3. Electronic Application This part is commonly used in the following electronic environments: * **Telecom & Networking:** Cooling high-speed ASICs and FPGAs. * **Embedded Systems:** Industrial PCs and controllers. * **Power Electronics:** Dissipating heat from MOSFET arrays or voltage regulators. --- ### 4. Dimensional Diagram (Approximate) ```text 45mm <-----------> ________________ ^ | |||||||||||| | | | |||||||||||| | | 15mm (Height) |_||||||||||||_| v [Push-Pin] [Push-Pin] ```
    ✨ Follow-up Questions
    • ⤷ What are the alternative attachment methods if my PCB doesn't have holes?
    • ⤷ How does the air flow rate (LFM) impact the thermal resistance of this specific heat sink?
    • ⤷ What is the difference between the C1 and C2 finish codes in ATS parts?