ATS-21F-68-C2-R0
AI

The **ATS-21F-68-C2-R0** is a high-performance thermal management component manufactured by **Advanced Thermal Solutions (ATS)**. Specifically, it is a heat sink designed for cooling electronic components such as CPUs, GPUs, and other high-heat-generating surface-mount devices.
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### 1. Technical Specifications
The part number follows a specific nomenclature used by ATS to define its physical and thermal characteristics.
| Feature | Specification |
| :--- | :--- |
| **Component Type** | Heat Sink |
| **Series** | pushPIN™ |
| **Material** | Aluminum (Blue Anodized) |
| **Attachment Method** | Push-Pin |
| **Dimensions (L x W)** | 45mm x 45mm |
| **Height** | 15mm |
| **Fin Style** | Straight Fin |
| **Thermal Resistance** | ~15.31 °C/W (Unducted @ 100 LFM) |
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### 2. Key Design Features
#### A. pushPIN™ Attachment System
The "21F" designation indicates the use of the **pushPIN™** system. This mechanism provides:
* **Constant Pressure:** A high-performance compression spring ensures uniform pressure across the component surface for maximum heat transfer.
* **Secure Fit:** Push-pins are available in brass or plastic and are designed to lock into pre-drilled holes on the PCB.
#### B. Material and Finish
* **Aluminum Construction:** Offers a lightweight solution with excellent thermal conductivity.
* **Blue Anodized Coating:** The "C2" suffix refers to the finish. Anodizing increases surface area slightly at a microscopic level, protects against corrosion, and improves emissivity.
#### C. Thermal Interface Material (TIM)
The "R0" suffix typically denotes that the part comes pre-applied with a high-performance thermal phase-change material or tape, ensuring a "plug-and-play" installation without needing to manually apply thermal paste.
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### 3. Electronic Application
This part is commonly used in the following electronic environments:
* **Telecom & Networking:** Cooling high-speed ASICs and FPGAs.
* **Embedded Systems:** Industrial PCs and controllers.
* **Power Electronics:** Dissipating heat from MOSFET arrays or voltage regulators.
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### 4. Dimensional Diagram (Approximate)
```text
45mm
<----------->
________________ ^
| |||||||||||| | |
| |||||||||||| | | 15mm (Height)
|_||||||||||||_| v
[Push-Pin] [Push-Pin]
```
- ⤷
What are the alternative attachment methods if my PCB doesn't have holes?
- ⤷ How does the air flow rate (LFM) impact the thermal resistance of this specific heat sink?
- ⤷ What is the difference between the C1 and C2 finish codes in ATS parts?