ATS-21F-69-C2-R0
AI

The **ATS-21F-69-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** series, designed to provide efficient cooling for high-power electronic components.
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### 1. Technical Specifications
The following table highlights the core technical data for this specific part number:
| Parameter | Specification | Details |
| :--- | :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions Inc. | Part of the maxiFLOW™ series |
| **Material** | Aluminum | High thermal conductivity |
| **Finish** | Blue Anodized | Corrosion resistance and aesthetic |
| **Attachment Method** | pushPIN™ | Spring-loaded mounting for secure fit |
| **Thermal Resistance** | 3.24 °C/W (at 200 LFM) | Lower is better for heat dissipation |
| **Dimensions (L x W)** | 40mm x 40mm | Standard footprint for many ICs |
| **Height** | 20mm | Low profile for dense boards |
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### 2. Design Characteristics
This part is engineered for applications where space is limited but thermal loads are high.
* **Fin Geometry:** It features a flared fin design. This maximizes the surface area while maintaining a low pressure drop, allowing air to flow through more easily from high-speed fans.
* **pushPIN™ Attachment:** The "R0" in the part number indicates the mounting style. It uses a specialized pin and spring mechanism that ensures consistent pressure between the heat sink and the chip (e.g., FPGA, CPU, or GPU), optimizing thermal transfer.
* **Thermal Interface Material (TIM):** Typically, these units come pre-applied with high-performance thermal tape or grease to simplify the assembly process.
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### 3. Applications
The ATS-21F-69-C2-R0 is commonly used in the following electronic sectors:
1. **Telecommunications:** Cooling network switches and routers.
2. **Computing:** Heat management for high-speed processors or chipsets.
3. **Embedded Systems:** Industrial PCs where fan noise or space is a constraint.
4. **Power Electronics:** Dissipating heat from MOSFETs or IGBTs.
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### 4. Part Number Breakdown
Understanding the nomenclature helps in selecting similar parts:
* **ATS:** Manufacturer (Advanced Thermal Solutions).
* **21F:** Series/Family designator.
* **69:** Specific physical dimensions/fin count configuration.
* **C2:** Blue Anodized finish.
* **R0:** Plastic pushPIN™ attachment type.
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What are the alternative mounting methods for the ATS maxiFLOW series?
- ⤷ How does the thermal resistance change at higher airflow rates like 400 LFM?
- ⤷ What is the recommended hole pattern on the PCB for the pushPIN attachment?