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  • ATS-21F-69-C2-R0

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    The **ATS-21F-69-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** series, designed to provide efficient cooling for high-power electronic components. --- ### 1. Technical Specifications The following table highlights the core technical data for this specific part number: | Parameter | Specification | Details | | :--- | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | Part of the maxiFLOW™ series | | **Material** | Aluminum | High thermal conductivity | | **Finish** | Blue Anodized | Corrosion resistance and aesthetic | | **Attachment Method** | pushPIN™ | Spring-loaded mounting for secure fit | | **Thermal Resistance** | 3.24 °C/W (at 200 LFM) | Lower is better for heat dissipation | | **Dimensions (L x W)** | 40mm x 40mm | Standard footprint for many ICs | | **Height** | 20mm | Low profile for dense boards | --- ### 2. Design Characteristics This part is engineered for applications where space is limited but thermal loads are high. * **Fin Geometry:** It features a flared fin design. This maximizes the surface area while maintaining a low pressure drop, allowing air to flow through more easily from high-speed fans. * **pushPIN™ Attachment:** The "R0" in the part number indicates the mounting style. It uses a specialized pin and spring mechanism that ensures consistent pressure between the heat sink and the chip (e.g., FPGA, CPU, or GPU), optimizing thermal transfer. * **Thermal Interface Material (TIM):** Typically, these units come pre-applied with high-performance thermal tape or grease to simplify the assembly process. --- ### 3. Applications The ATS-21F-69-C2-R0 is commonly used in the following electronic sectors: 1. **Telecommunications:** Cooling network switches and routers. 2. **Computing:** Heat management for high-speed processors or chipsets. 3. **Embedded Systems:** Industrial PCs where fan noise or space is a constraint. 4. **Power Electronics:** Dissipating heat from MOSFETs or IGBTs. --- ### 4. Part Number Breakdown Understanding the nomenclature helps in selecting similar parts: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **21F:** Series/Family designator. * **69:** Specific physical dimensions/fin count configuration. * **C2:** Blue Anodized finish. * **R0:** Plastic pushPIN™ attachment type.
    ✨ Follow-up Questions
    • ⤷ What are the alternative mounting methods for the ATS maxiFLOW series?
    • ⤷ How does the thermal resistance change at higher airflow rates like 400 LFM?
    • ⤷ What is the recommended hole pattern on the PCB for the pushPIN attachment?