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  • ATS-21F-70-C2-R0

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    The **ATS-21F-70-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed for cooling electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Dimensions (L x W x H)** | 45mm x 45mm x 25mm | | **Thermal Resistance** | ~3.58 °C/W (at 200 LFM) | | **Fin Type** | XCUT (Straight Fin) | --- ### 2. Key Design Features * **XCUT Fin Pattern:** Unlike solid blocks, the fins are cross-cut. This creates a more turbulent airflow, which increases the surface area exposed to moving air, significantly improving heat dissipation compared to standard straight fins. * **Thermal Interface Material (TIM):** This part usually comes pre-applied with **T766** (or similar) Phase Change Material. This ensures a low-resistance thermal path between the chip and the aluminum base. * **Push-Pin Attachment:** It utilizes a tool-less attachment system. The push-pins (plastic or brass) are inserted through pre-drilled holes in the PCB, compressed by springs to provide consistent downward pressure for optimal thermal contact. --- ### 3. Usage and Application This component is typically found in: 1. **Networking Hardware:** Switches and routers where high-speed processors generate significant heat. 2. **Power Electronics:** Inverters or power supplies. 3. **Industrial Controls:** Cooling FPGA or ASIC chips that run continuously in enclosed environments. --- ### 4. Part Number Breakdown | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **21F** | Product Series (Push-Pin Heat Sink) | | **70** | Specific thermal/physical configuration code | | **C2** | Thermal Interface Material (TIM) type / Spring material | | **R0** | RoHS Compliance / Revision code |
    ✨ Follow-up Questions
    • ⤷ What is the hole-to-hole spacing required on the PCB for this heat sink?
    • ⤷ What are the advantages of the XCUT fin design over standard straight fins?
    • ⤷ Can the plastic push-pins be replaced with brass versions for higher vibration environments?