ATS-21F-70-C2-R0
AI

The **ATS-21F-70-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed for cooling electronic components like CPUs, GPUs, or high-power transistors.
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### 1. Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Plastic) |
| **Spring Type** | Compression Spring |
| **Dimensions (L x W x H)** | 45mm x 45mm x 25mm |
| **Thermal Resistance** | ~3.58 °C/W (at 200 LFM) |
| **Fin Type** | XCUT (Straight Fin) |
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### 2. Key Design Features
* **XCUT Fin Pattern:** Unlike solid blocks, the fins are cross-cut. This creates a more turbulent airflow, which increases the surface area exposed to moving air, significantly improving heat dissipation compared to standard straight fins.
* **Thermal Interface Material (TIM):** This part usually comes pre-applied with **T766** (or similar) Phase Change Material. This ensures a low-resistance thermal path between the chip and the aluminum base.
* **Push-Pin Attachment:** It utilizes a tool-less attachment system. The push-pins (plastic or brass) are inserted through pre-drilled holes in the PCB, compressed by springs to provide consistent downward pressure for optimal thermal contact.
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### 3. Usage and Application
This component is typically found in:
1. **Networking Hardware:** Switches and routers where high-speed processors generate significant heat.
2. **Power Electronics:** Inverters or power supplies.
3. **Industrial Controls:** Cooling FPGA or ASIC chips that run continuously in enclosed environments.
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### 4. Part Number Breakdown
| Segment | Meaning |
| :--- | :--- |
| **ATS** | Manufacturer (Advanced Thermal Solutions) |
| **21F** | Product Series (Push-Pin Heat Sink) |
| **70** | Specific thermal/physical configuration code |
| **C2** | Thermal Interface Material (TIM) type / Spring material |
| **R0** | RoHS Compliance / Revision code |
- ⤷
What is the hole-to-hole spacing required on the PCB for this heat sink?
- ⤷ What are the advantages of the XCUT fin design over standard straight fins?
- ⤷ Can the plastic push-pins be replaced with brass versions for higher vibration environments?