The **ATS-21F-71-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions, Inc. (ATS). It is part of the "push-pin" attachment series designed for cooling electronic components like CPUs, GPUs, and power modules. --- ### 1. Technical Specifications The following table summarizes the key physical and thermal properties of this specific part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Fin Style** | Straight (Vertical) | | **Thermal Resistance** | 6.70°C/W (at 1.0 m/s airflow) | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Dimensions** | 45mm x 45mm x 30mm | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Key Design Components #### A. Fin Geometry The "71" in the part number corresponds to a specific fin profile. These are **Straight Fins** designed for unidirectional airflow. This design provides a large surface area for heat dissipation while maintaining a relatively low pressure drop across the sink. #### B. Push-Pin Attachment Mechanism Instead of using adhesive tapes or complex brackets, this part uses a **Push-Pin** system: * **Ease of Assembly:** Pins snap into pre-drilled holes on the PCB. * **Compression Spring:** A spring provides consistent pressure across the interface, ensuring optimal heat transfer between the electronic chip and the aluminum base. #### C. Thermal Interface Material (TIM) The unit comes pre-applied with **T766**. This is a phase-change or high-performance thermal grease that fills microscopic air gaps between the component and the heat sink, significantly reducing thermal resistance. --- ### 3. Applications This part is typically found in the following electronic environments: * **Telecommunications:** Cooling of high-speed networking chips. * **Embedded Systems:** Dissipating heat from industrial controllers. * **Computing:** Secondary cooling for chipsets or power regulators on a motherboard. --- ### 4. Part Number Decoding (Breakdown) `ATS` - `21` - `F` - `71` - `C2` - `R0` * **ATS:** Advanced Thermal Solutions (Manufacturer). * **21:** Part of the pushPIN™ product family. * **F:** Fine pitch fin configuration. * **71:** Specific height/fin geometry identifier. * **C2:** Material/Color code (Aluminum, Blue Anodized). * **R0:** Revision/Standard packaging code.