The **ATS-21F-79-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heat sink**. It is designed to dissipate heat from surface-mount components like CPUs, GPUs, or FPGAs. --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Product Series** | pushPIN™ Heat Sink | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | Compression Spring (Stainless Steel) | | **Thermal Interface** | Pre-applied T766 Phase Change Material | --- ### 2. Physical Dimensions Precision sizing is critical for ensuring no interference with surrounding components on the PCB (Printed Circuit Board). * **Length:** 45.00 mm * **Width:** 45.00 mm * **Height (Fin Height):** 20.00 mm * **Pitch (Hole-to-Hole):** 38.00 mm (Standard spacing for push-pin mounting) --- ### 3. Thermal Performance Thermal resistance is measured based on the airflow (Velocity) within the electronic enclosure. * **Unducted Flow:** 26.32 °C/W @ 100 LFM (Linear Feet per Minute). * **Ducted Flow:** 1.37 °C/W @ 400 LFM. * **Efficiency:** The "mini-fan" fin design increases surface area and creates turbulence, which helps strip away the boundary layer of hot air more effectively than standard extruded heat sinks. --- ### 4. Component Breakdown #### A. The Heat Sink (Aluminum) The body is made of **Aluminum 6063**, which offers a high thermal conductivity-to-weight ratio. The **Blue Anodized** coating is not just aesthetic; it provides corrosion resistance and increases surface emissivity, which slightly improves radiative cooling. #### B. The Push-Pin Mechanism Instead of using messy adhesives or permanent solder, this part uses **brass push-pins** and **stainless steel springs**. * **Benefit:** Provides consistent "clamping force" on the chip, ensuring the thermal interface material is compressed evenly. * **Repairability:** Allows for easy removal and re-installation during maintenance. #### C. Thermal Interface Material (TIM) The **T766** is a "Phase Change Material." When the electronic component heats up, the material softens to fill microscopic air gaps between the chip surface and the heat sink base, maximizing heat transfer. --- ### 5. Application Use-Case This part is typically found in: * **Telecommunications:** Cooling high-speed switching chips. * **Industrial PC:** Ruggedized computers requiring passive or forced-air cooling. * **Embedded Systems:** High-power modules that require a secure mechanical attachment due to vibration risks.