## ATS-21F-91-C2-R0: Technical Overview The **ATS-21F-91-C2-R0** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). It is designed specifically for thermal management in electronic systems, particularly for cooling Integrated Circuits (ICs), BGAs, and other surface-mount components. --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-21F-91-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin | | **Thermal Resistance** | 12.94°C/W (Unducted Flow @ 200 LFM) | | **Dimensions (L x W x H)** | 40mm x 40mm x 10mm | | **Fin Type** | XC-Cut (Cross-Cut) | --- ### 2. Major Components and Design Features #### A. XC-Cut Fin Design The "XC-Cut" refers to the straight-fin design with cross-cuts. This allows for: * **Omnidirectional Airflow:** Air can enter and exit from multiple directions, making it ideal for systems where airflow direction isn't strictly controlled. * **Increased Surface Area:** The cross-cuts maximize the area available for heat dissipation. #### B. Push-Pin Attachment The component uses a **Push-Pin** mounting mechanism with a built-in spring. * **Stability:** Provides consistent pressure on the thermal interface material (TIM). * **Reliability:** Ensures the heat sink remains attached during mechanical shocks or vibrations. * **Hole Pattern:** Requires pre-drilled holes in the PCB. #### C. Thermal Interface Material (TIM) The "R0" at the end of the part number typically indicates the inclusion of a specific high-performance thermal interface (usually a phase-change material or thermal tape) pre-applied to the base to ensure optimal heat transfer from the chip to the aluminum. --- ### 3. Thermal Performance Metrics The effectiveness of the heat sink varies based on the Air Velocity (Measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 21.97 | | 200 (1.0 m/s) | 12.94 | | 400 (2.0 m/s) | 7.13 | | 600 (3.0 m/s) | 5.33 | --- ### 4. Applications * **Telecommunications:** Used in routers and switches. * **Computing:** Ideal for cooling secondary processors or chipsets on motherboards. * **Power Supplies:** Heat dissipation for voltage regulators.