ATS-21F-92-C2-R0
AI

The **ATS-21F-92-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power semiconductors.
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### 1. Technical Specifications
Below are the primary technical parameters for this specific part number:
| Parameter | Specification |
| :--- | :--- |
| **Type** | Board Level Heat Sink (Push-Pin Mount) |
| **Thermal Resistance** | 16.48°C/W (at 200 LFM) |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Plastic) with Spring |
| **Thermal Interface (TIM)** | T766 (Pre-applied phase change material) |
| **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 15.00mm |
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### 2. Design Characteristics
The part belongs to the **push-pin** series, which is a popular mounting solution in modern PCB assembly.
* **Finned Geometry:** This part typically features a "straight fin" or "cross-cut" design to maximize surface area for convective cooling.
* **Push-Pin Attachment:** It uses two plastic push-pins and integrated springs. This provides consistent pressure (load) on the electronic chip, which optimizes the heat transfer through the Thermal Interface Material (TIM).
* **Aluminum Construction:** Chosen for its high thermal conductivity and lightweight properties, making it ideal for mobile or high-density computing environments.
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### 3. Electronic Application
The ATS-21F-92-C2-R0 is commonly used in the following electronic systems:
1. **Network Switches/Routers:** Cooling high-speed processing ASICs.
2. **Industrial Controllers:** Managing heat in motor drivers or power modules.
3. **Embedded Systems:** Protecting SoCs (System on a Chip) from thermal throttling.
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### 4. Part Number Decoder
The part number follows a specific logic:
* **ATS:** Advanced Thermal Solutions (Manufacturer).
* **21:** Series/Geometry type.
* **92:** Specific mechanical configuration.
* **C2:** Material/Finish code (Blue Anodized).
* **R0:** Revision or RoHS compliance status.
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What is the significance of the T766 Thermal Interface Material applied to this part?
- ⤷ How does the LFM (Linear Feet per Minute) impact the cooling performance of this heat sink?
- ⤷ Are there alternative mounting methods if the push-pin holes are not present on the PCB?