The **ATS-21F-93-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for cooling integrated circuits (ICs) such as CPUs, GPUs, or FPGAs. --- ## 1. Technical Specifications The following table outlines the core physical and thermal properties of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Dimensions (L x W x H)** | 40mm x 40mm x 20mm | | **Fin Style** | Straight Fin | | **Thermal Resistance** | ~7.37 °C/W (at 100 LFM) | --- ## 2. Key Component Features ### A. Material and Design * **Aluminum 6063:** This alloy is chosen for its excellent thermal conductivity and structural integrity. * **Straight Fin Design:** The fins are arranged in a parallel fashion, which is ideal for systems with unidirectional airflow (forced convection). ### B. Mounting Mechanism (Push-Pin) The "R0" designation usually refers to the specific mounting hardware kit included. * **Efficiency:** Push-pins allow for quick assembly and provide consistent pressure on the semiconductor surface, ensuring a tight thermal interface. * **Reliability:** The brass or plastic pins coupled with compression springs accommodate thermal expansion and vibration. ### C. Thermal Interface Material (TIM) * Typically, these units come with a pre-applied **Phase Change Material (PCM)** or a thermal pad on the base to minimize air gaps between the heat sink and the chip. --- ## 3. Application Use Cases This specific part is generally used in environments where vertical space is limited (20mm height) but high heat dissipation is required: 1. **Telecommunications:** Networking switches and routers. 2. **Embedded Systems:** Industrial PCs and automation controllers. 3. **Power Electronics:** Cooling MOSFET arrays or voltage regulators. ---