The **ATS-21F-97-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **blueICE™** series and is designed for high-density electronic cooling applications. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of the part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-21F-97-C2-R0 | | **Heat Sink Type** | Push-Pin (BGA) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Dimensions (L x W)** | 25mm x 25mm | | **Height** | 10.00mm | | **Thermal Resistance** | 20.30°C/W @ (Natural Convection) | | **Fin Configuration** | Straight Fin | --- ### 2. Electronic Application & Usage This part is used to dissipate heat from integrated circuits (ICs) that generate significant thermal energy during operation. * **Target Components:** High-speed microprocessors, BGA (Ball Grid Array) packages, FPGAs, and power transistors. * **Mechanical Connection:** The "Push-Pin" mechanism ensures a secure attachment to the PCB (Printed Circuit Board) using pre-drilled holes, providing constant pressure on the electronic component for optimal thermal contact. * **Thermal Interface Material (TIM):** It typically comes with a pre-applied thermal interface material (like T766) to reduce air gaps between the chip and the aluminum base. --- ### 3. Key Features 1. **Aluminum Construction:** Offers a high strength-to-weight ratio and excellent thermal conductivity. 2. **Blue Anodized Finish:** Increases surface emissivity and provides corrosion resistance. 3. **Cross-Cut/Straight Fin Design:** Optimized for airflow in both horizontal and vertical orientations, making it versatile for different chassis layouts. 4. **Reliability:** The push-pin attachment is more robust than adhesive tapes in high-vibration environments. ---