ATS-21F-99-C2-R0
AI

The **ATS-21F-99-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** designed for cooling electronic devices like BGAs, CPUs, and GPUs. It is part of the Advanced Thermal Solutions (ATS) "maxiFLOW™" series.
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### 1. Technical Specifications
Below are the primary physical and performance characteristics of the component:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions Inc. |
| **Material** | Aluminum (Black Anodized) |
| **Dimensions** | 45.00mm x 45.00mm |
| **Height** | 20.00mm |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Thermal Resistance** | 11.52°C/W (at 1.0 m/s airflow) |
| **Fin Style** | Straight / maxiFLOW™ |
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### 2. Key Design Features
* **maxiFLOW™ Geometry:** The fin design is optimized to increase surface area for more efficient radiation and convection cooling while maintaining a low pressure drop.
* **pushPIN™ Attachment:** This model uses a plastic or brass push-pin mechanism with a high-performance compression spring. This ensures:
* Consistent pressure across the component.
* Simplified installation and removal.
* A secure fit even in high-vibration environments.
* **Thermal Interface Material (TIM):** This specific model typically comes pre-applied with **T766** phase-change material or similar, ensuring immediate thermal conductivity upon installation without needing separate thermal paste.
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### 3. Electronic Application
This part is used in circuits where high-density integration causes localized heating. Common applications include:
1. **Telecommunications:** Cooling of high-speed networking chips.
2. **Power Electronics:** Dissipating heat from MOSFETs or Power Modules.
3. **Industrial Controls:** Managing thermals in PLC units and ruggedized controllers.
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### 4. Part Number Breakdown (Nomenclature)
* **ATS**: Advanced Thermal Solutions.
* **21**: Series number.
* **F**: Fin Type (maxiFLOW).
* **99**: Specific size/geometry code.
* **C2**: Color/Finish (Black Anodized).
* **R0**: RoHS compliance status.
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What are the different pushPIN material options for this series?
- ⤷ How does the thermal resistance change at higher airflow speeds?
- ⤷ Is there a variant of this heat sink with a different height?