The **ATS-50190P-C1-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is specifically designed for cooling electronic components, such as BGA (Ball Grid Array) packages, CPUs, or GPUs, where space is limited but thermal demands are high. --- ### 1. Technical Specifications The following table outlines the key physical and thermal properties of the part: | Parameter | Specification | | :--- | :--- | | **Part Number** | ATS-50190P-C1-R0 | | **Material** | Aluminum (Black Anodized) | | **Dimensions** | 19.0mm x 19.0mm x 17.5mm (L x W x H) | | **Fin Style** | Straight Fin | | **Attachment Method** | "maxiGRIP" (Plastic Clip and Spring) | | **Thermal Resistance** | ~6.50 °C/W (at 200 LFM) | | **Thermal Interface (TIM)** | Saint-Gobain C8000 (Pre-applied) | --- ### 2. Key Electronic Features #### A. Thermal Management Strategy This part is a **passive cooling** component. Its purpose is to increase the surface area of a semiconductor device to dissipate heat more efficiently into the surrounding air. In high-density electronic circuits, it prevents "thermal throttling" or hardware failure due to overheating. #### B. The maxiGRIP Attachment System Unlike many heat sinks that require adhesive tape or permanent epoxy, this part uses the **maxiGRIP** mounting system. This consists of: * **Plastic Frame Clip:** Attaches around the perimeter of the component. * **Stainless Steel Spring Clip:** Applies steady, even pressure across the center of the heat sink. * **Reliability:** This mechanical attachment ensures the heat sink does not shift under vibration or high temperatures, which is critical for industrial or telecommunication electronics. #### C. Thermal Interface Material (TIM) The part comes with **Saint-Gobain C8000** phase-change material pre-applied to the base. * **Function:** It fills the microscopic air gaps between the chip surface and the aluminum base. * **Electronic Benefit:** Maximizes heat transfer efficiency, ensuring the junction temperature of the silicon remains within safe operating limits. --- ### 3. Application Use-Cases * **Telecommunications:** Cooling ASICs in routers and switches. * **Computing:** Secondary cooling for chipsets or small form-factor CPUs. * **Industrial Power:** Managing heat for power converters or motor controllers.