The **ATS-50250P-C1-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **maxiFLOW™** series, which is specifically designed to provide high thermal performance in environments with constrained airflow. --- ### 1. Technical Specifications Below are the primary technical parameters for this component: | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-50250P-C1-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 2.50 °C/W (at 200 LFM) | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 50mm x 50mm x 25mm | | **Fin Style** | maxiFLOW (Tapered Fin) | --- ### 2. Key Design Elements #### A. maxiFLOW™ Geometry The unique "flared" or tapered fin design increases the surface area for heat dissipation while minimizing pressure drop. This allows the heat sink to perform exceptionally well even in low-airflow conditions common in densely packed electronic enclosures. #### B. pushPIN™ Attachment Instead of using messy thermal adhesives or tapes, this model uses a **pushPIN™** system. * **Benefits:** Ensures consistent pressure on the heat source (CPU/GPU/FPGA), which optimizes thermal interface material (TIM) performance. * **Hardware:** It typically includes a brass or plastic pin and a stainless steel spring for secure mounting. #### C. Thermal Interface Material (TIM) The "C1" in the part number usually indicates that the heat sink comes pre-assembled with a high-performance thermal pad or phase-change material, reducing assembly time during manufacturing. --- ### 3. Common Applications This part is used to cool medium-to-high power electronic components, including: * **Processors (CPUs/GPUs):** Embedded computing boards. * **FPGAs & ASICs:** High-speed telecommunications and networking gear. * **Power Supplies:** DC-DC converters and high-density power modules. * **Industrial Controls:** Systems requiring ruggedized, bolt-on cooling solutions. --- ### 4. Thermal Performance Comparison *Performance varies based on Airflow (LFM - Linear Feet per Minute):* | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 | 2.50 | | 300 | 1.80 | | 400 | 1.50 | | 600 | 1.20 |