The **ATS-50270G-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "maxiFLOW™" series, specifically designed for cooling high-power electronic components like CPUs, GPUs, FPGAs, and ASICs. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Material** | Aluminum (Black Anodized) | | **Dimensions (L x W x H)** | 27mm x 27mm x 9.5mm | | **Mounting Style** | maxiGRIP™ (Frame Clip) | | **Thermal Resistance** | 5.30 °C/W (at 200 LFM) | | **Pressure Drop** | 0.28 (in. H2O) | | **Attachment Method** | Mechanical Clip + Thermal Interface Material (TIM) | --- ### 2. Core Electronic/Thermal Features #### A. maxiFLOW™ Fin Geometry The heat sink utilizes a unique **flared fin design**. Unlike standard straight fins, these fins angle outward, which increases the surface area and maximizes air intake. This is particularly effective in systems where airflow is directed via fans or ducting. #### B. maxiGRIP™ Attachment System This part uses a specific mechanical attachment called the **maxiGRIP™ system**: * **Plastic Frame Clip:** A high-temperature plastic frame snaps around the component. * **Stainless Steel Spring Clip:** A "steady spring" provides constant pressure across the center of the heat sink. * **Benefit:** It avoids the need to drill holes in the PCB and allows for easy removal/re-installation without damaging the motherboard. #### C. Thermal Interface Material (TIM) The unit typically comes pre-applied with **Chomerics T766** phase-change material. This ensures that the microscopic gaps between the component (silicon) and the heat sink (aluminum) are filled, minimizing thermal resistance. --- ### 3. Application Use-Cases Electronic engineers typically specify the ATS-50270G-C2-R0 for: * **Network Switches:** Cooling high-speed processing chips. * **Industrial PCs:** Where space is limited (low profile 9.5mm height). * **Small Form Factor (SFF) Boards:** Used in 27mm x 27mm footprint chips. --- ### 4. Installation Diagram Concept ```text [ Heat Sink ] <-- ATS-50270G-C2-R0 |---| <-- Thermal Interface Material [ Chip ] <-- The Processor (FPGA/ASIC) [ Clip ] <-- maxiGRIP™ Frame (snaps to chip/PCB) ```