The **ATS-50290P-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "maxiFLOW™" series, specifically designed for cooling electronic components like processors, FPGAs, and ASICs in air-cooled environments. --- ### 1. Technical Specifications The following table summarizes the physical and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Product Series** | maxiFLOW™ | | **Material** | Aluminum (with Blue Anodized Finish) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W)** | 29.00 mm x 29.00 mm | | **Height** | 17.50 mm | | **Thermal Resistance** | 3.50 °C/W (at 200 LFM) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Key Design Components #### A. Fin Geometry The "maxiFLOW™" design features a **tapered fin structure**. Unlike standard square-cut fins, these are designed to: * Increase surface area for heat dissipation. * Minimize pressure drop, allowing air to flow more easily through the fins. * Maximize airflow efficiency in constrained spaces. #### B. pushPIN™ Attachment This model uses a **pushPIN™** system rather than adhesive tape. * **Mechanism:** Uses a brass or plastic pin with a stainless steel spring. * **Benefit:** Provides consistent pressure on the component, improving thermal contact and making the assembly more secure against mechanical shock and vibration. #### C. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. * This eliminates the need for manual thermal paste application. * It ensures an even layer of high-conductivity material between the electronic component and the aluminum base. --- ### 3. Application Use Cases This heat sink is typically found in: * **Networking Equipment:** High-speed routers and switches. * **Embedded Systems:** Industrial PCs and controllers. * **Telecommunications:** Base stations and signal processing units.