The **ATS-50310P-C1-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "maxiFLOW" product line, designed specifically for cooling electronic components such as processors, FPGAs, and ASICs in high-density environments. --- ### 1. Technical Specifications The following table highlights the core physical and thermal characteristics of this specific component: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum (Black Anodized) | | **Dimensions** | 31.00mm x 31.00mm | | **Height** | 10.00mm | | **Attachment Method** | pushPIN™ | | **Thermal Resistance** | 5.20 °C/W (at 200 LFM) | | **Flow Pattern** | maxiFLOW (Tapered Fin Design) | | **Interface Material** | T766 (Thermal Tape) | --- ### 2. Key Features * **maxiFLOW™ Design:** The heat sink features a unique "flared" or tapered fin structure. This geometry maximizes the surface area for heat dissipation while increasing air intake and reducing pressure drop. * **pushPIN™ Attachment:** This model uses a pushPIN™ mounting system, which ensures consistent pressure across the component for optimal thermal contact. It typically includes a brass or plastic pin with a stainless steel spring. * **Low Profile:** With a height of only 10mm, it is ideal for low-profile applications like 1U rack servers or compact embedded systems. * **Pre-Applied TIM:** It comes with **Phase Change Material (T766)** or thermal tape pre-applied to the base, simplifying the assembly process and ensuring high thermal conductivity between the chip and the aluminum. --- ### 3. Application Use Cases The ATS-50310P-C1-R0 is commonly used in the following electronic sectors: 1. **Telecommunications:** Cooling networking chips in switches and routers. 2. **Computing:** Thermal management for Northbridge/Southbridge chips or small CPUs. 3. **Industrial:** Cooling power modules or motor controllers that generate significant localized heat. --- ### 4. Thermal Performance Comparison Thermal resistance varies based on the Air Velocity (Measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 5.20 | | 300 (1.5 m/s) | 4.10 | | 400 (2.0 m/s) | 3.50 | | 600 (3.0 m/s) | 2.80 |