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  • ATS-50330G-C2-R0

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    The **ATS-50330G-C2-R0** is a high-performance heat sink component manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, specifically designed for cooling high-power electronic components like CPUs, GPUs, FPGAs, and ASICs. --- ### 1. Technical Specifications Below is a detailed breakdown of the physical and thermal properties of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Anodized Blue) | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 14.50mm | | **Attachment Method** | maxiGRIP™ (Frame Clip) | | **Thermal Resistance** | 3.40°C/W @ 200 LFM | | **Fin Style** | Tapered Fin Design | | **Thermal Interface Material** | Pre-applied T766 Phase Change Material | --- ### 2. Key Electronic & Design Features #### A. maxiFLOW™ Tapered Fin Design The "G" in the part number signifies a high-performance fin geometry. The tapered design maximizes the surface area for heat dissipation while minimizing the pressure drop. This allows air to flow more freely through the fins, making it ideal for high-density electronic enclosures. #### B. maxiGRIP™ Attachment System This part uses a unique mechanical attachment system: * **Plastic Frame Clip:** Replaces traditional adhesives or screws. * **Stainless Steel Spring:** Provides constant, high-pressure contact between the heat sink and the electronic chip to ensure optimal thermal conductivity. * **Non-Destructive:** Allows for easy removal and re-attachment without damaging the PCB or the component. #### C. Thermal Interface Material (TIM) The unit comes pre-applied with **T766**. This is a phase-change material that softens at operating temperatures to fill microscopic air gaps between the heat sink and the component, significantly reducing thermal impedance. --- ### 3. Application Examples This part is typically found in the following electronic environments: 1. **Telecommunications:** High-speed routers and switches. 2. **Industrial PCs:** Small form factor motherboards where vertical clearance is limited (14.5mm height). 3. **Power Electronics:** Voltage regulator modules (VRMs). ---
    ✨ Follow-up Questions
    • ⤷ What are the advantages of the maxiGRIP attachment over traditional thermal tape?
    • ⤷ Can this heat sink be used in natural convection environments?
    • ⤷ How does the T766 phase change material compare to standard thermal grease?