The **ATS-50330P-C1-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "maxiFLOW™" product line, designed specifically for cooling electronic components like processors, FPGAs, and ASICs in high-airflow environments. --- ### 1. Technical Specifications The following table summarizes the physical and thermal characteristics of this specific part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Anodized) | | **Dimensions (L x W x H)** | 33mm x 33mm x 17.5mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 2.50°C/W (at 200 LFM) | | **Fin Style** | maxiFLOW (Tapered Fin) | | **Pressure Drop** | High efficiency with low pressure drop | --- ### 2. Design and Component Breakdown #### A. The Heat Sink Body (maxiFLOW™) The primary electronic function of this part is **passive thermal management**. The "maxiFLOW" design features a flared fin structure. This geometry maximizes the surface area for heat dissipation while increasing the speed of the air flowing through the fins, which is critical for preventing thermal throttling in high-power chips. #### B. The Attachment System (pushPIN™) Unlike simple adhesive tapes, the **C1-R0** variant uses a mechanical push-pin system. * **Springs:** Ensure constant, high pressure between the heat sink and the chip. * **Thermal Interface Material (TIM):** This part usually comes pre-applied with high-performance thermal grease or a phase-change pad to ensure there are no air gaps between the component and the aluminum. #### C. Material and Coating * **Aluminum:** Chosen for its high thermal conductivity and light weight. * **Blue Anodized Finish:** Provides surface protection and improves radiant heat transfer. --- ### 3. Application Use Cases This part is typically found in the following electronic hardware: 1. **Networking Gear:** Routers, switches, and high-speed hubs. 2. **Embedded Systems:** Industrial PCs and motherboards. 3. **Power Supplies:** Cooling MOSFETs or power regulators. --- ### 4. Thermal Performance Data Performance varies based on the Air Velocity (Measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 | 2.50 | | 400 | 1.80 | | 600 | 1.50 | | 800 | 1.30 |