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  • ATS-50375G-C2-R0

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    The **ATS-50375G-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "maxiFLOW™" series, specifically designed for cooling high-power electronic components like CPUs, GPUs, FPGAs, and ASICs in air-cooled environments. --- ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-50375G-C2-R0 | | **Thermal Resistance** | 2.30 °C/W (at 200 LFM) | | **Material** | Aluminum (Black Anodized) | | **Dimensions (L x W x H)** | 37.50mm x 37.50mm x 12.50mm | | **Attachment Method** | maxiGRIP™ (Frame Clip) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### Key Design Components #### 1. maxiFLOW™ Fin Geometry The heat sink features a unique **flared fin design**. This geometry increases the surface area for heat dissipation while maintaining a low pressure drop. The spread-out fins allow for better airflow intake from all directions, making it highly effective in constrained spaces where air direction might vary. #### 2. maxiGRIP™ Attachment System This is a high-reliability mechanical mounting system: * **Frame Clip:** A plastic frame attaches to the PCB around the component. * **Spring Clip:** A "steady-spring" metal clip applies consistent pressure across the center of the heat sink. * **Benefit:** This method eliminates the need to drill holes in the PCB and ensures the heat sink remains secure even during high shock or vibration. #### 3. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. T766 is a phase-change material that offers low thermal impedance and fills the microscopic air gaps between the component surface and the heat sink base to maximize heat transfer. --- ### Applications * **Telecommunications:** Cooling of high-speed network switches and routers. * **Data Centers:** Cooling server processors and memory controllers. * **Industrial PC:** Cooling embedded systems where vertical clearance (12.5mm height) is limited.
    ✨ Follow-up Questions
    • ⤷ What are the advantages of the maxiGRIP attachment over traditional adhesive tapes?
    • ⤷ How does the LFM (Linear Feet per Minute) affect the thermal resistance of this part?
    • ⤷ Can this heat sink be used with components larger than 37.5mm?