ATS-50375G-C2-R0
AI

The **ATS-50375G-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "maxiFLOW™" series, specifically designed for cooling high-power electronic components like CPUs, GPUs, FPGAs, and ASICs in air-cooled environments.
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### Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Part Number** | ATS-50375G-C2-R0 |
| **Thermal Resistance** | 2.30 °C/W (at 200 LFM) |
| **Material** | Aluminum (Black Anodized) |
| **Dimensions (L x W x H)** | 37.50mm x 37.50mm x 12.50mm |
| **Attachment Method** | maxiGRIP™ (Frame Clip) |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
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### Key Design Components
#### 1. maxiFLOW™ Fin Geometry
The heat sink features a unique **flared fin design**. This geometry increases the surface area for heat dissipation while maintaining a low pressure drop. The spread-out fins allow for better airflow intake from all directions, making it highly effective in constrained spaces where air direction might vary.
#### 2. maxiGRIP™ Attachment System
This is a high-reliability mechanical mounting system:
* **Frame Clip:** A plastic frame attaches to the PCB around the component.
* **Spring Clip:** A "steady-spring" metal clip applies consistent pressure across the center of the heat sink.
* **Benefit:** This method eliminates the need to drill holes in the PCB and ensures the heat sink remains secure even during high shock or vibration.
#### 3. Thermal Interface Material (TIM)
The unit comes with **T766** pre-applied to the base. T766 is a phase-change material that offers low thermal impedance and fills the microscopic air gaps between the component surface and the heat sink base to maximize heat transfer.
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### Applications
* **Telecommunications:** Cooling of high-speed network switches and routers.
* **Data Centers:** Cooling server processors and memory controllers.
* **Industrial PC:** Cooling embedded systems where vertical clearance (12.5mm height) is limited.
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What are the advantages of the maxiGRIP attachment over traditional adhesive tapes?
- ⤷ How does the LFM (Linear Feet per Minute) affect the thermal resistance of this part?
- ⤷ Can this heat sink be used with components larger than 37.5mm?