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  • ATS-50400P-C1-R0

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    The **ATS-50400P-C1-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push-pin" series designed specifically for cooling electronic components like CPUs, GPUs, and other high-heat integrated circuits. --- ## 1. Technical Specifications The following table outlines the physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 15.00mm | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 3.20°C/W (at 200 LFM) | | **Fin Style** | Straight Fin | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ## 2. Key Components & Design Features ### A. Fin Geometry (Straight Fin) The device utilizes a **straight-fin design**, which is optimized for **forced convection** (airflow provided by a fan). The spacing between the fins is engineered to provide a low pressure drop while maximizing the surface area for heat dissipation. ### B. Attachment Mechanism (Push-Pin) Instead of adhesive tapes or heavy screws, this model uses a **spring-loaded push-pin system**: * **Plastic Push-Pins:** These provide a secure, vibration-resistant attachment to the PCB. * **Springs:** The springs ensure consistent downward pressure on the electronic component, which is critical for minimizing thermal contact resistance. ### C. Thermal Interface Material (TIM) The "R0" suffix indicates that the heat sink comes with **T766** pre-applied. This is a phase-change material that fills microscopic air gaps between the heat sink base and the chip surface to improve heat transfer. --- ## 3. Typical Applications This specific heat sink is commonly found in the following electronic environments: * **Networking Hardware:** Routers, switches, and bridges. * **Embedded Systems:** Industrial PCs and automation controllers. * **Power Supplies:** Cooling MOSFETs and voltage regulators. --- ## 4. Engineering Comparison: Airflow vs. Thermal Resistance As airflow increases, the efficiency of the ATS-50400P-C1-R0 improves significantly: ```python # Approximate Thermal Resistance (TR) values at different Airflow (LFM) performance_data = { "Airflow_LFM": [200, 300, 400, 500, 600], "TR_Celsius_per_Watt": [3.20, 2.50, 2.10, 1.90, 1.70] } ```
    ✨ Follow-up Questions
    • ⤷What is the hole-to-hole spacing required on the PCB for this heat sink?
    • ⤷ Can the push-pins be replaced with metal hardware for high-vibration environments?
    • ⤷ How does the T766 thermal material compare to standard thermal grease?