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  • ATS-50450G-C2-R0

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    The **ATS-50450G-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "maxiFLOW™" product line, specifically designed for cooling high-power electronic components like CPUs, GPUs, FPGAs, and ASICs. --- ### 1. Key Technical Specifications The following table summarizes the primary mechanical and thermal properties of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Black Anodized) | | **Dimensions** | 45.00mm x 45.00mm | | **Height** | 12.50mm | | **Attachment Method** | maxiGRIP™ (Spring Clip) | | **Thermal Resistance** | 2.50°C/W (at 200 LFM) | | **Flow Pattern** | Spread Fin / Tapered | | **Thermal Interface Material (TIM)** | Chomerics T766 (Pre-applied) | --- ### 2. Design and Component Breakdown #### A. Fin Geometry (maxiFLOW™ Design) The "maxiFLOW" design features a flared fin structure. This increases the surface area while reducing the pressure drop, allowing air to move more freely through the fins. This is critical in high-density PCB environments where airflow might be restricted. #### B. The maxiGRIP™ Attachment System One of the most notable "parts" of this assembly is the attachment mechanism. Unlike adhesive tapes or screws, it uses: * **Plastic Frame Clip:** A high-strength plastic frame that surrounds the electronic component. * **Stainless Steel Spring Clip:** A "cobra" shaped clip that snaps over the heat sink and locks into the frame. This provides consistent downward pressure for optimal thermal contact. #### C. Thermal Interface Material (TIM) The base of the heat sink comes pre-applied with **Chomerics T766**. This is a phase-change material that fills the microscopic air gaps between the chip surface and the heat sink base, significantly reducing thermal resistance. --- ### 3. Applications This specific part is commonly used in: * **Telecommunications:** High-speed routers and switches. * **Computing:** High-performance servers and workstations. * **Industrial Power:** Power supplies and motor controllers. ---
    ✨ Follow-up Questions
    • ⤷ What are the advantages of the maxiGRIP attachment over traditional thermal adhesive?
    • ⤷ How does the pressure drop of the maxiFLOW design affect fan selection?
    • ⤷ Can the pre-applied T766 thermal material be replaced with standard thermal paste?