ATS-50450G-C2-R0
AI

The **ATS-50450G-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "maxiFLOW™" product line, specifically designed for cooling high-power electronic components like CPUs, GPUs, FPGAs, and ASICs.
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### 1. Key Technical Specifications
The following table summarizes the primary mechanical and thermal properties of this component:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum (Black Anodized) |
| **Dimensions** | 45.00mm x 45.00mm |
| **Height** | 12.50mm |
| **Attachment Method** | maxiGRIP™ (Spring Clip) |
| **Thermal Resistance** | 2.50°C/W (at 200 LFM) |
| **Flow Pattern** | Spread Fin / Tapered |
| **Thermal Interface Material (TIM)** | Chomerics T766 (Pre-applied) |
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### 2. Design and Component Breakdown
#### A. Fin Geometry (maxiFLOW™ Design)
The "maxiFLOW" design features a flared fin structure. This increases the surface area while reducing the pressure drop, allowing air to move more freely through the fins. This is critical in high-density PCB environments where airflow might be restricted.
#### B. The maxiGRIP™ Attachment System
One of the most notable "parts" of this assembly is the attachment mechanism. Unlike adhesive tapes or screws, it uses:
* **Plastic Frame Clip:** A high-strength plastic frame that surrounds the electronic component.
* **Stainless Steel Spring Clip:** A "cobra" shaped clip that snaps over the heat sink and locks into the frame. This provides consistent downward pressure for optimal thermal contact.
#### C. Thermal Interface Material (TIM)
The base of the heat sink comes pre-applied with **Chomerics T766**. This is a phase-change material that fills the microscopic air gaps between the chip surface and the heat sink base, significantly reducing thermal resistance.
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### 3. Applications
This specific part is commonly used in:
* **Telecommunications:** High-speed routers and switches.
* **Computing:** High-performance servers and workstations.
* **Industrial Power:** Power supplies and motor controllers.
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- ⤷
What are the advantages of the maxiGRIP attachment over traditional thermal adhesive?
- ⤷ How does the pressure drop of the maxiFLOW design affect fan selection?
- ⤷ Can the pre-applied T766 thermal material be replaced with standard thermal paste?