The **ATS-51170R-C1-R0** is a high-performance thermal management component, specifically a **Heat Sink** designed for cooling electronic components such as CPUs, GPUs, FPGAs, or power modules. It is manufactured by Advanced Thermal Solutions (ATS). Below is a breakdown of its technical specifications and features. --- ### 1. Technical Specifications This component belongs to the **maxiFLOW™** series, which utilizes a unique flared fin design to maximize airflow and thermal dissipation. | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-51170R-C1-R0 | | **Dimensions (L x W x H)** | 17.0mm x 17.0mm x 24.5mm | | **Material** | Aluminum (Black Anodized) | | **Thermal Resistance** | 5.50 °C/W (at 200 LFM) | | **Attachment Method** | maxiGRIP™ (Frame Clip) | | **Interface Material** | T766 (Thermal Tape/Paste) | --- ### 2. Key Design Features #### A. maxiFLOW™ Fin Geometry The fins are not parallel; they are flared outwards. This design reduces pressure drop and enhances natural or forced convection by providing a larger surface area for heat exchange without significantly increasing the footprint. #### B. maxiGRIP™ Attachment System Instead of using permanent adhesives or drilling holes into the PCB, this part uses a **plastic frame clip** and a **stainless steel spring clip**. * **Benefits:** Allows for easy assembly and removal without damaging the board. It provides steady even pressure across the component (TIM) for optimal heat transfer. #### C. Material and Coating * **Aluminum 6063:** Chosen for its high thermal conductivity and lightweight properties. * **Black Anodized Finish:** Improves radiation heat transfer and provides corrosion resistance. --- ### 3. Application Use Cases This specific size (17mm x 17mm) is ideal for small, high-heat-density components: * **Networking:** Small routers, switches, and SFP modules. * **Embedded Systems:** Industrial PC processors and SOCs. * **Power Electronics:** High-speed voltage regulators or MOSFET arrays. --- ### 4. Thermal Performance Comparison The effectiveness of the heat sink depends on the Air Velocity (LFM - Linear Feet per Minute). | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 LFM | 5.50 | | 300 LFM | 4.40 | | 400 LFM | 3.80 | | 600 LFM | 3.20 | ---