The **ATS-51300K-C2-R0** is a high-performance heat sink manufactured by Advanced Thermal Solutions (ATS). It is part of the **maxiFLOW™** series, designed specifically for cooling electronic components such as processors, FPGAs, and ASICs that require efficient heat dissipation in constrained spaces. --- ### 1. Technical Specifications The following table highlights the core physical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Series** | maxiFLOW™ | | **Attachment Method** | maxiGRIP™ (Frame Clip) | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W x H)** | 30mm x 30mm x 14.5mm | | **Thermal Resistance (Unducted)** | 4.60 °C/W @ 200 LFM | | **Thermal Resistance (Ducted)** | 3.50 °C/W | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Components & Features #### A. maxiFLOW™ Fin Design The heat sink features a unique **tapered fin geometry**. This design maximizes the surface area for radiant cooling and increases air turbulence, which significantly improves thermal performance compared to standard straight-fin heat sinks. #### B. maxiGRIP™ Attachment System This part uses a specialized mechanical fastening system consisting of: * **Plastic Frame Clip:** Replaces permanent adhesives or thermal tapes. * **Stainless Steel "Steady Drive" Spring:** Provides consistent pressure across the component for optimal heat transfer. * **Benefits:** It allows for easy removal and re-attachment during maintenance without damaging the PCB. #### C. Thermal Interface Material (TIM) The unit comes with **T766** phase-change material pre-applied to the base. * **Function:** It fills microscopic air gaps between the heat sink base and the electronic component. * **Performance:** It provides low thermal impedance, ensuring heat flows efficiently from the silicon to the aluminum fins. --- ### 3. Electronic Application Use-Cases The ATS-51300K-C2-R0 is typically found in high-density electronic environments: 1. **Telecommunications:** Used on high-speed networking chips and routers. 2. **Embedded Systems:** Cooling industrial PCs and controllers where airflow might be directional. 3. **Power Electronics:** Dissipating heat from high-load voltage regulators. ---