The **ATS-51330R-C1-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "maxiFLOW™" series, designed specifically for cooling electronic components such as processors, FPGAs, and ASICs in high-airflow environments. --- ### 1. Technical Specifications The following table summarizes the key physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Dimensions** | 33.00mm x 33.00mm | | **Height** | 24.50mm | | **Material** | Aluminum (Extruded) | | **Finish** | Blue Anodized | | **Attachment Method** | maxiGRIP™ (Frame Clip) | | **Thermal Resistance** | 2.50°C/W @ 200 LFM | --- ### 2. Core Electronic Components & Technologies #### A. Thermal Interface Material (TIM) This heat sink comes pre-assembled with **Chomerics T766**. This is a high-performance Phase Change Material (PCM) or thermal tape that fills microscopic air gaps between the component (CPU/GPU) and the heat sink base to ensure maximum heat transfer. #### B. maxiGRIP™ Attachment System Unlike permanent adhesives, the C1-R0 utilizes a mechanical attachment system consisting of: 1. **Plastic Frame Clip:** Replaces traditional holes in the PCB. 2. **Stainless Steel Spring Clip:** Provides steady, high pressure (3.5 to 7.0 psi) to ensure the heat sink remains in contact with the semiconductor even under vibration. #### C. Fin Geometry The "maxiFLOW" design features a **flared fin geometry**. This increases the effective surface area compared to standard straight-fin heat sinks, allowing for better air intake and heat dissipation in systems with forced-air cooling (fans). --- ### 3. Common Applications This specific part is typically found in: * **Networking Hardware:** High-speed routers and switches. * **Telecommunications:** Base stations and signal processing units. * **Embedded Computing:** Industrial PC modules and high-speed controllers. ---