The **ATS-51350R-C1-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "maxiFLOW™" series, designed specifically for cooling electronic components such as processors, FPGAs, and ASICs in high-airflow environments. --- ### 1. Technical Specifications The following table highlights the primary physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 35.00mm | | **Material** | Aluminum (Anodized Blue) | | **Attachment Method** | maxiGRIP™ (Frame Clip) | | **Thermal Resistance** | 1.10 °C/W @ 200 LFM | | **Shape** | Square, Slanted Fin Design | --- ### 2. Key Electronic & Mechanical Features #### A. Slanted Fin Design Unlike traditional straight-fin heat sinks, the maxiFLOW™ design features a **slanted fin geometry**. This increases the surface area and creates more turbulence in the airflow, which significantly enhances the thermal efficiency (heat dissipation) without requiring a larger footprint. #### B. maxiGRIP™ Attachment System The "R0" in the part number often signifies the inclusion of the **maxiGRIP™** mounting mechanism. This is a critical electronic hardware feature: * **Plastic Frame Clip:** A high-strength clip that snaps onto the component. * **Stainless Steel Spring Clip:** Applies steady, even pressure across the surface of the chip. * **No Holes Required:** It allows for secure mounting without needing to drill holes into the Printed Circuit Board (PCB). #### C. Thermal Interface Material (TIM) This model typically comes pre-applied with a high-performance **Thermal Interface Material (Chomerics T766)**. This ensures there are no microscopic air gaps between the component die and the heat sink base, maximizing heat transfer. --- ### 3. Application Use Cases This specific heat sink is used for electronic parts that generate significant heat in a compact space: * **Networking Equipment:** High-speed routers and switches. * **Power Supplies:** Heat dissipation for voltage regulators. * **Embedded Systems:** Industrial PCs and automation controllers. * **Telecommunications:** Base stations and signal processing units. ---