The **ATS-51400R-C1-R0** is a high-performance heat sink manufactured by Advanced Thermal Solutions (ATS). It is part of the **maxiFLOW™** series, specifically designed for cooling electronic components that require efficient thermal management in confined spaces with high airflow. --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (with Blue Anodized finish) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 1.10°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 40mm x 40mm x 24.5mm | | **Fin Style** | maxiFLOW (Tapered Fin Design) | --- ### 2. Physical and Material Design The part is engineered to maximize surface area and airflow efficiency. * **maxiFLOW™ Geometry:** The fins are tapered and spread outwards. This design reduces pressure drop and increases the surface area exposed to moving air, making it more effective than standard straight-fin heat sinks. * **Thermal Interface Material (TIM):** This specific model typically comes with **SAINT-GOBAIN C700** or a similar high-performance thermal pad pre-applied to the base to ensure optimal heat transfer from the component to the aluminum. * **Blue Anodized Coating:** The blue finish isn't just aesthetic; it provides surface protection against corrosion and slightly improves radiative heat transfer. --- ### 3. Attachment Mechanism: pushPIN™ One of the most critical "electronic parts" of this assembly is the mounting hardware. The **pushPIN™** system consists of: 1. **Brass/Plastic Pins:** Used to secure the heat sink to the Printed Circuit Board (PCB). 2. **Compression Springs:** These provide a precise "Force on Component." This ensures constant contact between the heat sink and the chip (e.g., a BGA or FPGA) without cracking the silicon die. 3. **Hole Pattern:** It requires pre-drilled holes in the PCB, usually following a standard 33mm or 40mm pitch. --- ### 4. Typical Applications This component is commonly used to cool the following types of integrated circuits (ICs): * **FPGAs & CPUs:** High-power logic chips in networking gear. * **ASICs:** Application-specific chips in telecommunications. * **GPU/VRAM:** Memory modules or small processors in industrial computing. ---