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  • ATS-51425K-C2-R0

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    The **ATS-51425K-C2-R0** is a high-performance thermal management component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **maxiFLOW™** series, specifically designed for cooling electronic components like processors, FPGAs, and ASICs. --- ### 1. Technical Specifications The following table summarizes the core electronic and physical attributes of the part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-51425K-C2-R0 | | **Component Type** | Heat Sink | | **Thermal Resistance** | 2.50°C/W (at 200 LFM) | | **Attachment Method** | maxiGRIP™ (Steady pressure clip) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions** | 42.5mm x 42.5mm x 14.5mm | --- ### 2. Key Electronic Features #### A. Thermal Resistance Efficiency The primary function of this part is to dissipate heat from sensitive electronic components. With a thermal resistance of **2.50°C/W**, it is highly efficient at transferring heat from the semiconductor junction to the surrounding air, preventing thermal throttling or hardware failure. #### B. maxiFLOW™ Fin Design Unlike standard square-cut heat sinks, the maxiFLOW™ design uses a tapered fin structure. This increases the surface area while reducing pressure drop, allowing for better airflow through the sink even in high-density electronic enclosures. #### C. maxiGRIP™ Attachment System This part uses a specialized mechanical attachment system: * **Plastic Frame Clip:** Replaces the need for holes in the PCB. * **Steady Pressure:** Ensures uniform contact between the heat sink and the electronic chip, which is critical for consistent thermal performance. * **Safety:** Prevents damage to the delicate edges of the electronic component during installation. --- ### 3. Application Use-Cases This heat sink is typically found in the following electronic environments: 1. **Networking Equipment:** High-speed routers and switches. 2. **Embedded Systems:** Industrial PCs and controllers. 3. **Telecommunications:** Base stations and signal processing units. ---
    ✨ Follow-up Questions
    • ⤷What is the difference between blue anodized and gold anodized finishes for heat sinks?
    • ⤷ Does this part require a specific thermal interface material (TIM)?
    • ⤷ What are the advantages of using maxiGRIP over adhesive thermal tape?