ATS-51425K-C2-R0
AI

The **ATS-51425K-C2-R0** is a high-performance thermal management component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **maxiFLOW™** series, specifically designed for cooling electronic components like processors, FPGAs, and ASICs.
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### 1. Technical Specifications
The following table summarizes the core electronic and physical attributes of the part:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Part Number** | ATS-51425K-C2-R0 |
| **Component Type** | Heat Sink |
| **Thermal Resistance** | 2.50°C/W (at 200 LFM) |
| **Attachment Method** | maxiGRIP™ (Steady pressure clip) |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Dimensions** | 42.5mm x 42.5mm x 14.5mm |
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### 2. Key Electronic Features
#### A. Thermal Resistance Efficiency
The primary function of this part is to dissipate heat from sensitive electronic components. With a thermal resistance of **2.50°C/W**, it is highly efficient at transferring heat from the semiconductor junction to the surrounding air, preventing thermal throttling or hardware failure.
#### B. maxiFLOW™ Fin Design
Unlike standard square-cut heat sinks, the maxiFLOW™ design uses a tapered fin structure. This increases the surface area while reducing pressure drop, allowing for better airflow through the sink even in high-density electronic enclosures.
#### C. maxiGRIP™ Attachment System
This part uses a specialized mechanical attachment system:
* **Plastic Frame Clip:** Replaces the need for holes in the PCB.
* **Steady Pressure:** Ensures uniform contact between the heat sink and the electronic chip, which is critical for consistent thermal performance.
* **Safety:** Prevents damage to the delicate edges of the electronic component during installation.
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### 3. Application Use-Cases
This heat sink is typically found in the following electronic environments:
1. **Networking Equipment:** High-speed routers and switches.
2. **Embedded Systems:** Industrial PCs and controllers.
3. **Telecommunications:** Base stations and signal processing units.
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- ⤷What is the difference between blue anodized and gold anodized finishes for heat sinks?
- ⤷ Does this part require a specific thermal interface material (TIM)?
- ⤷ What are the advantages of using maxiGRIP over adhesive thermal tape?